Bumped Resonator Structure for Superconducting Qubit Coherence
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Solution Overview
Problem
Current superconducting quantum computing technologies face challenges in scaling up due to introduction of lossy materials and connections, which limit qubit coherence times and degrade performance, particularly in transition and connection regions of superconducting qubit circuits.
Innovation Solution
A compact lumped element resonator structure spanning two superconducting circuit planes, where capacitive energy is maintained on one plane and inductive energy on the other, keeping electrical currents off the qubit plane and on the readout path, with well-controlled electromagnetic fields to avoid coupling with lossy parts of the system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If superconducting qubit circuits use traditional planar structures with all components on the same plane, then fabrication is simpler, but lossy materials and connections are introduced that limit qubit coherence times
Solution Approach 1:
The patent transitions from a traditional planar two-dimensional layout to a three-dimensional stacked architecture where capacitive elements are positioned on a first plane and inductive elements on a second plane separated by a dielectric layer. This vertical stacking eliminates the need for lossy interconnect materials between qubits while maintaining electrical connectivity through controlled electromagnetic coupling between the stacked layers, thereby improving qubit coherence time without excessive fabrication complexity.
2Reliability
If all circuit components are placed on the same plane, then device layout is simpler, but electrical currents pass through lossy interconnect regions degrading performance
Solution Approach 1:
The invention separates capacitive and inductive components onto different vertical planes with a dielectric layer in between, allowing electrical currents to flow on the first plane while magnetic fields are confined to the dielectric region. This spatial separation eliminates current passage through lossy interconnect regions, improving performance while maintaining manufacturability through standard layered fabrication techniques.
3Reliability
If compact lumped element resonator structure is used with separated planes, then lossy components are isolated from qubits, but fabrication process becomes more complex
Solution Approach 1:
The patent implements a vertically stacked configuration where the capacitive element resides on a first substrate plane, the inductive element on a second substrate plane, separated by a dielectric layer. This three-dimensional arrangement isolates lossy interconnect components from the qubit region while utilizing standard semiconductor fabrication processes for depositing and patterning multiple layers, making the enhanced coherence compatible with existing manufacturing capabilities.
4Reliability
If traditional planar resonator structure is used, then footprint is larger, but electromagnetic field control is less precise
Solution Approach 1:
By stacking capacitive and inductive elements vertically with precise spacing through a dielectric layer, the patent achieves compact lumped element resonator structures that confine electromagnetic fields to specific three-dimensional regions. This vertical integration dramatically reduces the horizontal footprint while providing superior control over electromagnetic field distributions through precise geometric configuration of the stacked components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances qubit coherence by isolating lossy components from qubits and interconnects, maintaining a small footprint and reducing decoherence effects, thus facilitating the scaling of superconducting quantum computing hardware.
Implementation Method 1
a capacitive element having a first portion on a first surface and a second portion on a second surface, the first and second portions having an equipotential
Implementation Method 2
A non-limiting example of the structure includes an inductive element on a first surface, a capacitive element on the first surface and a second surface
Data Source
Figure 1
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AI summary
A resonator structure that can be utilized with superconducting qubit circuits. An inductive element is on a first surface. A capacitive element is on the first surface and a second surface. An interconnect structure is between the first surface and the second surface.