Bumpless Chip Package Bridge Using Hybrid Bonding
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Solution Overview
Problem
Current chiplet integration technologies, such as EMIB and Direct Bonded Heterogeneous Integration, face challenges with complex flip-chip assembly and poor yield due to the need for embedded bridges and micro-bumps, which complicate the packaging process and require a flat surface for subsequent packaging steps.
Innovation Solution
A bumpless chip package structure is achieved by hybrid bonding metal first pads on chips with bridge pads, using a package carrier with solder balls for electrical connection, resulting in a lower profile, higher density, and simpler substrate with improved electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If embedded bridges with micro-bumps are used for chiplet integration, then electrical connection between chips is achieved, but the packaging process becomes complex and yield deteriorates
Solution Approach 1:
The invention extracts and eliminates the micro-bump component from the traditional EMIB structure. By using direct metal-to-metal hybrid bonding between chip pads and bridge pads, the patent removes the need for separate micro-bump formation and embedding steps, thereby simplifying the packaging process while maintaining electrical connectivity
Solution Approach 2:
The invention merges the electrical connection function into the direct hybrid bonding interface between chip pads and bridge pads. By combining the interconnect function with the bonding structure itself, the patent eliminates the need for separate micro-bump layers and embedding procedures, reducing process complexity
2Reliability
If embedded bridges are used for chiplet integration, then electrical connection is achieved, but manufacturing yield deteriorates
Solution Approach 1:
The invention extracts the micro-bump formation step from the process flow and replaces it with direct hybrid bonding. This elimination of intermediate steps reduces the number of process variations and potential failure points, thereby improving manufacturing yield
Solution Approach 2:
The invention performs preliminary hybrid bonding of chip pads to bridge pads before final package assembly. By establishing electrical connections in advance through direct metal bonding, the process reduces the complexity of subsequent assembly steps and improves overall yield
3Reliability
If micro-bumps are used for interconnect, then electrical connection is achieved, but the profile increases
Solution Approach 1:
The invention extracts and removes the micro-bump structure from the package design. By using direct hybrid bonding between flat metal pads, the patent eliminates the vertical height contribution of micro-bumps, resulting in a lower overall package profile
Solution Approach 2:
Instead of building up electrical connections through elevated micro-bumps, the invention inverts the approach by using planar metal-to-metal hybrid bonding. This inversion eliminates the need for vertical bump structures and achieves electrical connection through direct contact between flat surfaces, reducing profile height
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bumpless design enables a lower profile, higher density, and lower cost chip package with better electrical performance by eliminating the need for micro-bumps and simplifying the packaging process, while maintaining effective electrical connectivity between chips and the bridge.
Implementation Method 1
Each first pad is hybrid bonded with each bridge pad to form a hybrid bonding pad
Implementation Method 2
The second pads of each chip are electrically connected with the carrier pads of the package carrier through the solder balls
Data Source
AI summary
A chip package structure includes a package carrier, a plurality of chips, a bridge and a plurality of solder balls or C4 bumps. The package carrier includes a plurality of carrier pads. The chips are arranged side by side on the package carrier. Each of the chips includes a plurality of first pads and a plurality of second pads. The bridge is located between the chips and the package carrier and includes a plurality of bridge pads. Each of the first pads is hybrid bonded with each of the bridge pads to form a hybrid bonding pad, so that the chips are electrically connected to each other through the bridge. The solder balls are located between the package carrier and the chips. The second pads of each of the chips are electrically connected to the carrier pads of the package carrier through the solder balls.