Bumpless Electronic Device Package With Via Alignment
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Solution Overview
Problem
The existing electronic device packaging process is inefficient due to insecure die placement, complex process requirements for varying die sizes, and inadequate heat dissipation, leading to low yield and potential overheating of the devices.
Innovation Solution
A method involving a substrate with vias and I/O units, a gluing layer for secure die placement, forming fixing layers and metallic conductive units connected to I/O units, and a passivation layer for improved electrical and thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If through-holes are made slightly larger than dice to accommodate them, then dice can be placed in through-holes, but dice may get stuck obliquely and fail to be mounted on fixing tape, causing low yield
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses in the substrate before placing the dice. These recesses are specifically designed to guide and position the dice correctly, preventing oblique placement. The recesses act as preliminary positioning structures that ensure dice are correctly oriented before the bonding process, thereby solving the positioning accuracy problem while maintaining ease of operation.
2Reliability
If dice are fully enclosed with glue in through-holes, then dice are securely fixed, but heat generated during operation cannot be efficiently dissipated, causing overheating
Solution Approach 1:
The patent applies segmentation by dividing the through-hole into two functional zones: an upper recess portion that encloses the dice with glue for secure fixation, and a lower extension portion that remains open to allow heat dissipation. This segmentation creates distinct functional regions within the same structural element, simultaneously achieving both secure mounting and thermal management.
Solution Approach 2:
The patent applies local quality by giving different portions of the through-hole different properties: the upper recess has enclosed walls for mechanical support and fixation, while the lower extension has an open structure for thermal dissipation. This local differentiation allows each region to perform its specific function optimally without compromising the other.
3Adaptability or versatility
If through-holes with various widths and lengths are used for dice of different sizes, then each die can be properly accommodated, but the packaging process becomes much complicated
Solution Approach 1:
The patent applies universality by designing a standardized through-hole structure that can accommodate dice of various sizes. The consistent recess-and-extension configuration serves multiple functions: positioning, fixation, and heat dissipation, regardless of the specific die size. This universal structure simplifies the packaging process while maintaining adaptability to different die dimensions.
Data Source
AI summary
The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate.