Bundled Exhaust Substrates with Frame for Compact Aftertreatment
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Solution Overview
Problem
Existing exhaust gas aftertreatment devices for internal combustion engines lack a compact and easily installable design, with complex assembly and disassembly processes, and insufficient rigidity leading to potential leaks.
Innovation Solution
A compact exhaust gas aftertreatment device featuring a housing assembly with radially outer fastening flanges and a substrate assembly bundled using a frame, where the substrates are held in place by connecting means, allowing for easy assembly and disassembly, and enhanced rigidity through direct contact and material bonding of the substrates' jackets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If bundled exhaust gas purification substrates are held in plates spaced apart from each other, then the device is compact, but the rigidity is insufficient leading to potential leaks
Solution Approach 1:
The patent merges multiple substrates into a bundled configuration where substrates are held in direct contact with each other rather than spaced apart. This combining approach increases rigidity and leak resistance while maintaining compactness through the integrated bundle structure.
Solution Approach 2:
The substrates are pre-bundled together in a rigid configuration before installation into the housing. This preliminary bundling ensures rigidity is built into the structure itself, preventing leaks without requiring additional spacing or support plates.
2Reliability
If substrates are held in place with complex assembly structures, then rigidity is improved, but assembly and disassembly become difficult
Solution Approach 1:
The device is segmented into a housing and a separate substrate bundle assembly. The substrates are pre-assembled into a rigid bundled unit that can be installed as a single module, simplifying the assembly process while maintaining rigidity through the bundled configuration.
Solution Approach 2:
A holder or support structure acts as an intermediary between the substrates and the housing, providing simple attachment points that maintain rigidity without requiring complex assembly mechanisms. The holder enables easy installation while ensuring structural stability.
3Volume of moving object
If substrates are arranged in a compact bundled configuration, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into two stages: first, substrates are manufactured individually using standard processes; second, they are bundled together in a pre-assembly step. This segmentation allows existing manufacturing capabilities to be used while achieving compact bundled configuration.
Solution Approach 2:
The substrates are prepared and bundled in advance before final installation. This preliminary bundling action simplifies the overall manufacturing workflow by separating substrate production from assembly, allowing each to be optimized independently while achieving the compact final configuration.
Data Source
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AI summary
The invention relates to an exhaust aftertreatment device (1) for an internal combustion engine, which at least partially removes pollutants from an exhaust gas stream introduced through an inlet opening (2) of the internal combustion engine and then discharges it through an outlet opening (4), comprising at least a housing assembly (6) with an inlet housing shell (10) and an outlet housing shell (20), and a substrate assembly (8) comprising several exhaust gas purification substrates (34) bundled using a frame (32). A frame (32) surrounds or encloses the bundled exhaust gas purification substrates (34) in the circumferential direction.A first radial outer mounting flange (18) of the inlet housing shell (10), a second radial outer mounting flange (28) of the outlet housing shell (20) and a third radial outer mounting flange (36) of the frame (32) are detachably connected to one another by connecting means (44) such that, on the one hand, the inlet housing shell (10) is connected to the outlet housing shell (20) and, on the other hand, the substrate assembly (8) is held within the housing assembly (6).