Bundled Memory Bus Width Customization via Scribe Line Mask Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing memory technologies are inflexible as they have fixed memory depth and bus width, limiting user customization and adaptability.
Innovation Solution
A bundled memory system is developed, where at least one mask layer is formed over scribe lines to create electrical connections between input/output buses of multiple memory dies, allowing for customizable memory depth and bus width configurations by connecting external input/output buses of varying sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If memory dies are isolated through scribe lines with no signal connection over die boundaries, then manufacturing simplicity is maintained, but adaptability and flexibility are reduced
Solution Approach 1:
The invention segments the electrical connection structure into multiple functional layers: mask layers formed over scribe lines, bonding pads on memory dies, and external input/output buses. This segmentation allows independent optimization of each component while achieving overall adaptability for customized memory configurations.
Solution Approach 2:
The mask layers formed over scribe lines act as intermediary elements that enable electrical signal transmission between previously isolated memory dies. These intermediary structures facilitate customizable memory depth and bus width without requiring complete redesign of the memory die architecture.
2Adaptability or versatility
If fixed memory depth and bus width are used in memory dies, then manufacturing precision is maintained, but adaptability to user requirements is reduced
Solution Approach 1:
The invention introduces dynamic configurability to previously fixed memory parameters. By forming electrical connections between multiple memory dies through mask layers and external input/output buses, the system can dynamically adjust memory depth and bus width to match user requirements while maintaining standardized manufacturing processes for individual memory dies.
Solution Approach 2:
The external input/output buses serve multiple functions: they connect different memory dies, enable customizable memory configurations, and maintain compatibility with standard manufacturing processes. This multi-functionality achieves user adaptability without compromising manufacturing ease.
3Adaptability or versatility
If electrical connections are formed over scribe lines using mask layers, then adaptability is improved, but manufacturing complexity increases
Solution Approach 1:
The mask layers are formed over scribe lines during the manufacturing process before final assembly, establishing predetermined electrical connection paths. This preliminary action ensures precise electrical connections while maintaining manufacturing efficiency through integrated process planning.
Data Source
AI summary
A bundled memory includes a substrate, a first memory die, a second memory die, a scribe line, and an electrical connection. The first memory die has a first input/output bus, and the second memory die has a second input/output bus, where the first memory die and the second memory die are formed over the substrate. The scribe line is formed between the first memory die and the second memory die. The electrical connection is formed over the scribe line for electrically connecting to the first input/output bus and the second input/output bus, where the electrical connection is electrically connected to an external input/output bus, where a size of the external input/output bus of the bundled memory is larger than or equal to a size of the first input/output bus and a size of the second input/output bus.