Buried-Anchor Connection Rods for Dense Ambient-Temperature Assembly
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Solution Overview
Problem
Current microelectronic assembly techniques face challenges in forming efficient mechanical and electrical connections between components, particularly due to high thermal cycles and limitations in insertion force for large matrices, leading to suboptimal connection density and mechanical resistance.
Innovation Solution
The development of microelectronic devices with electrically conductive rods anchored in a dielectric layer, featuring a buried portion for enhanced mechanical resistance and a projecting portion for insertion into terminals, allowing for controlled formation of connection elements using via manufacturing methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If solder bumps are used for mechanical and electrical connection, then connection density can be achieved, but high thermal cycles at temperatures greater than 200°C are produced which can be incompatible with certain components
Solution Approach 1:
The patent replaces the thermal-based soldering process with a mechanical insertion process. Conductive inserts are mechanically pressed into terminals at ambient temperature, eliminating the need for high-temperature thermal cycles while achieving both mechanical connection and electrical continuity.
Solution Approach 2:
The patent introduces conductive inserts as intermediary elements between components. These inserts serve as mediators that provide both mechanical support and electrical connection, replacing the direct solder joint approach and enabling assembly at lower temperatures.
2Temperature
If conductive inserts are used for ambient temperature assembly, then thermal compatibility is improved, but insertion force limits are reached for large matrices and connection density is reduced
Solution Approach 1:
The patent optimizes the geometric dimensions of conductive inserts, particularly increasing their diameter and adjusting their aspect ratio. This dimensional change allows the inserts to achieve sufficient mechanical strength and electrical conductivity while maintaining feasibility for large-scale matrix assemblies, thereby improving connection density.
Solution Approach 2:
The patent modifies key parameters of the conductive inserts including material composition, diameter, length, and cross-sectional area. By optimizing these parameters, the inserts can withstand the required insertion forces for large matrices while maintaining electrical conductivity and mechanical integrity, thus achieving higher connection density.
3Temperature
If conductive inserts are used for ambient temperature assembly, then thermal compatibility is improved, but mechanical resistance is reduced compared to solder connections
Solution Approach 1:
The patent employs composite material structures for conductive inserts, combining materials with high mechanical strength and high electrical conductivity. This composite approach allows the inserts to achieve both the mechanical resistance needed for large matrices and the electrical conductivity required for signal transmission, overcoming the limitations of single-material solutions.
Solution Approach 2:
The patent increases the dimensional footprint of conductive inserts, particularly their diameter and base area, to distribute mechanical loads more effectively. This dimensional enhancement provides greater mechanical resistance and stability while maintaining electrical functionality, making the mechanical insertion approach comparable to or exceeding solder connections in strength.
4Ease of operation
If rod connection elements are added strictly projecting at the surface, then assembly is simplified, but mechanical resistance is insufficient for large matrices
Solution Approach 1:
The patent embeds portions of the conductive inserts into the substrate or mounting structure, creating a nested configuration where part of the insert is buried and part projects outward. This nested approach provides both the mechanical anchoring needed for strength and the projected portion needed for electrical connection and assembly simplicity.
Solution Approach 2:
The patent pre-configures the conductive inserts with optimized geometric parameters and material properties before assembly. This preliminary preparation ensures that the inserts have the necessary mechanical strength and dimensional characteristics to withstand insertion forces and provide reliable connections, eliminating the need for post-assembly modifications or reinforcements.
Data Source
AI summary
A system provided with a microelectronic device includes a substrate exposed on a face of the device, the substrate having at least one electrically conductive element, and an electrical connection member in electrical continuity with the element and including at least one rod projecting over the face of the device, wherein the connection member includes an inorganic anchoring portion covering the element and in that the rod comprises a portion buried in the anchoring portion followed by a portion projecting over the face of the device.