Buried Chip Antenna Module with Insulating Shield
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Solution Overview
Problem
The challenge is to reduce the size of electronic devices with antennas while minimizing noise interference from radiating elements, as existing configurations often require increased circuit board area due to the placement of reflector elements and chip components, leading to inefficiencies in high-frequency signal transmission.
Innovation Solution
The solution involves a configuration where chip components are buried in a resin layer with a reflector element and an insulating layer, positioned between the chip components and the radiating element, which reduces noise interference and allows for a more compact design by eliminating the need for additional mounting areas on the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If reflector elements and chip components are separately mounted on the circuit board, then noise interference is reduced, but the circuit board area increases
Solution Approach 1:
The patent combines the reflector element and chip components into a single integrated module structure. The chip components are mounted on a substrate that also carries the reflector element, allowing both elements to occupy the same spatial footprint on the circuit board. This merging eliminates the need for separate mounting areas while maintaining the noise isolation benefits through internal positioning and shielding arrangements within the module.
Solution Approach 2:
The patent implements a nested configuration where chip components are positioned within the spatial envelope defined by the reflector element, or vice versa. The module structure allows one component to be housed within or alongside the other, maximizing space utilization. This nesting approach enables both the reflector and chip components to coexist in a compact arrangement that reduces overall circuit board area while maintaining functional separation for noise reduction.
2Volume of moving object
If chip components are placed close to the radiating element, then device size is reduced, but noise interference increases
Solution Approach 1:
The patent introduces an insulating layer as an intermediary between the chip components and the radiating element. This insulating layer acts as a barrier that reduces electromagnetic coupling and noise interference while allowing the components to be positioned in close proximity. The intermediary material provides electrical isolation and shields the sensitive chip components from the high-frequency electromagnetic fields generated by the radiating element, enabling compact device design without sacrificing noise performance.
3Object-affected harmful factors
If additional mounting areas are provided for reflector elements, then noise interference is minimized, but device complexity increases
Solution Approach 1:
The patent merges the reflector element with the chip component mounting substrate to form a single integrated module. Instead of providing separate mounting areas on the circuit board, the reflector is incorporated into the module structure itself, reducing the number of discrete components and mounting operations required. This integration simplifies the overall device architecture while maintaining the noise isolation functionality through internal spatial arrangement and shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the size of electronic devices and minimizes noise interference, allowing for efficient high-frequency signal processing without increasing the circuit board area, thereby enhancing the compactness and performance of electronic devices.
Implementation Method 1
an insulating layer disposed on the reflector element... effectively reduces the size of electronic devices and minimizes noise interference
Data Source
AI summary
An electronic device includes a structure including a first resin layer, an electronic component buried in the first resin layer, a reflector element for antenna disposed on the first resin layer, and an insulating layer disposed on the reflector element; a semiconductor device; a second resin layer in which the structure and the semiconductor device are buried; and a radiating element of the antenna, the radiating element being disposed on the insulating layer and electrically coupled the semiconductor device.