Buried-Chip LED Pixel Package for Smaller Gaps and No Wire Bonds
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Solution Overview
Problem
Conventional LED package structures with wire bonding face challenges in miniaturization due to space constraints and reliability issues, as well as light interference from IC chips, which affect lighting effects and are prone to wire breakage.
Innovation Solution
A multiple pixel package structure with a buried chip, featuring a multi-layered circuit board, pixels arranged in an M×N array, and a control chip integrated within the board to reduce space and enhance reliability, allowing each pixel to produce targeted luminous characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wire bonding is used to electrically connect LEDs to IC chip, then electrical connection is achieved, but spaces must be reserved on circuit board for wire bonding which prevents significant reduction of gaps between LEDs
Solution Approach 1:
The patent extracts the IC chip from its conventional position on the circuit board surface and embeds it within the circuit board structure. This removal of the chip from the surface plane eliminates the need for wire bonding processes and associated space, allowing LEDs to be positioned much closer together without wire bonding interference.
Solution Approach 2:
The IC chip is nested within the circuit board structure, specifically positioned in a recessed area or cavity of the board. This nesting approach allows the chip to be integrated into the board's internal architecture rather than occupying surface space, thereby eliminating wire bonding requirements and enabling smaller LED gaps.
2Illumination intensity
If IC chip is placed on circuit board surface, then electrical connection to LEDs is achieved, but lights emitted at some angles are blocked by IC chip which negatively affects lighting effect
Solution Approach 1:
The IC chip is extracted from the light-emitting area and repositioned within the circuit board structure. This extraction removes the chip from the optical path, preventing it from blocking light emitted at various angles and thereby eliminating the negative impact on lighting effects and white balance.
Solution Approach 2:
The IC chip is moved from the two-dimensional surface plane to a third-dimensional position within the circuit board's thickness. This dimensional transition places the chip out of the light emission plane, allowing light to propagate freely in all directions without being blocked by the chip structure.
3Reliability
If wire bonding process is used, then electrical connection is achieved, but the process is relatively complicated and wires formed thereby can easily break under stress resulting in poor reliability
Solution Approach 1:
The wire bonding process is extracted and eliminated entirely by repositioning the IC chip within the circuit board. This removal of the bonding process eliminates the creation of fragile wire connections that are prone to breaking under stress, thereby significantly improving product reliability.
Solution Approach 2:
The IC chip and circuit board are merged into a single integrated structure where the chip is embedded within the board. This merging eliminates the need for separate wire bonding connections, creating a more robust and reliable structure where electrical connections are inherently more stable and resistant to stress.
Data Source
AI summary
A multiple pixel package structure with a buried chip and an electronic device using the same are provided. The multiple pixel package structure includes a multi-layered circuit board, a plurality of pixels, a protective layer, and a control chip. The pixels are arranged on the multi-layered circuit board and into an array. Each of the pixels includes a plurality of light emitting elements of different colors. The protective layer is formed on the multi-layered circuit board and covers the pixels. The control chip is buried in the multi-layered circuit board and electrically connected to the light emitting elements of each of the pixels, so as to allow each of the pixels to produce a target luminous characteristic.