Buried Circuit Pattern Formation Using Solid Component Fillers
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Solution Overview
Problem
The existing methods for forming buried circuit patterns on printed circuit boards using plating result in non-uniform etching, leading to shorts between adjacent patterns and errors in signal transmission due to differences in plating between patterned and non-patterned areas.
Innovation Solution
A method involving an insulating substrate with a resin material and solid components, where a circuit pattern groove is formed by etching and a plated layer is buried, followed by chemical and physical etching to expose the insulating layer, with the solid component's diameter being less than 5% of the pattern width to prevent voids and ensure reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If plating is used to form buried circuit patterns, then the circuit patterns can be formed on the insulating substrate, but non-uniform etching occurs leading to shorts between adjacent patterns and signal transmission errors
Solution Approach 1:
The patent applies local quality by introducing solid components (fillers) at specific locations within the insulating substrate where etching occurs. These fillers are strategically placed in the patterned areas to modify the etching behavior locally, ensuring uniform etching rates across different regions of the substrate while preventing shorts between adjacent circuit patterns.
Solution Approach 2:
The patent changes the physical and chemical parameters of the insulating substrate by incorporating solid components with specific properties (size, material composition, distribution). This modification alters the etching parameters, making the etching process more uniform across the substrate surface and eliminating the non-uniformity that previously caused manufacturing defects.
2Manufacturing precision
If solid components are added to the insulating substrate, then etching uniformity is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The patent applies preliminary action by incorporating the solid components (fillers) into the insulating substrate before the plating and etching processes. This pre-positioning of fillers ensures that the etching uniformity is achieved without requiring additional process steps during manufacturing, thereby reducing overall process complexity despite the initial modification to the substrate.
3Reliability
If the solid component diameter is reduced to less than 5% of pattern width, then void formation is prevented and reliability is improved, but the precision of component placement requirements increase
Solution Approach 1:
The patent changes the size parameter of the solid components to be less than 5% of the pattern width. This parameter change prevents void formation during etching while the patent simultaneously provides guidance on placement precision requirements to ensure reliable circuit pattern formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise and reliable formation of buried circuit patterns without shorts between adjacent patterns, improving signal transmission and reducing voids, thus enhancing the reliability and production rate of printed circuit boards.
Implementation Method 1
the plated layer of an upper part of the insulating layer is removed using a chemical and physical etching process
Implementation Method 2
the plated layer of an upper part of the insulating layer is removed using a chemical and physical etching process
Implementation Method 3
forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate
Data Source
AI summary
Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured.