Buried Circumferential Electrode Microcavity Plasma Arrays
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing microcavity plasma devices face challenges in cost-effective manufacturing of large arrays due to complex interconnect technologies and high capacitance, which restricts their application in display and lighting applications where addressability and reliability are crucial.
Innovation Solution
The development of microcavity plasma device arrays with buried circumferential metal electrodes in a metal oxide layer, where the electrodes are self-patterned during anodization, reducing capacitance and enabling flexible, inexpensive, and addressable arrays with reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If complex interconnect technologies are used in microcavity plasma device arrays, then device functionality and addressability are improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The device array is segmented into individually addressable microcavity plasma devices, each with its own circumferential electrode. The interconnect structure is also segmented into radial conductors that can be selectively connected to specific microcavities, enabling addressability while reducing overall complexity through modular organization
Solution Approach 2:
The circumferential electrodes serving individual microcavities are merged with radial interconnect conductors at shared connection points. This merging allows multiple microcavities to be addressed through common interconnect paths, reducing the total number of independent interconnect lines while maintaining individual addressability
2Reliability
If traditional interconnect methods are used, then electrical connections are established, but capacitance increases restricting application in display and lighting
Solution Approach 1:
The high-capacitance problematic elements are extracted from the system by using thin dielectric layers with low permittivity between conductive elements. The interconnect structure is designed to minimize overlapping conductive areas, thereby reducing parasitic capacitance while maintaining reliable electrical connections
Solution Approach 2:
The dielectric parameters are changed by selecting materials with appropriate thickness and permittivity characteristics. The geometric parameters of interconnect conductors are optimized to reduce capacitance, including minimizing conductor width and spacing to reduce parasitic effects while maintaining connection reliability
3Manufacturing precision
If conventional electrode fabrication is used, then electrodes are formed, but manufacturing cost and complexity increase
Solution Approach 1:
The electrode structure serves multiple functions simultaneously: the circumferential electrodes provide both the discharge electrode and part of the interconnect structure. The radial conductors are formed as integral parts of the substrate, eliminating the need for separate electrode fabrication steps and reducing manufacturing complexity
Solution Approach 2:
The circumferential electrodes perform dual functions as both the active discharge electrode for plasma generation and as an integral component of the interconnect structure. This multi-functionality reduces the total number of fabrication steps and material layers required, lowering manufacturing cost while maintaining precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces capacitance, allows for flexible and addressable microcavity plasma device arrays, enhancing their suitability for display and lighting applications by minimizing manufacturing costs and improving reliability through efficient electrode interconnections.
Implementation Method 1
The first circumferential electrodes are buried in a metal oxide layer and surround the microcavities, while being protected from plasma in the microcavities by the metal oxide
Implementation Method 2
the electrodes are self-patterned during anodization
Data Source
AI summary
A preferred embodiment microcavity plasma device array of the invention includes a plurality of first metal circumferential metal electrodes that surround microcavities in the device. The first circumferential electrodes are buried in a metal oxide layer and surround the microcavities in a plane transverse to the microcavity axis, while being protected from plasma in the microcavities by the metal oxide. In embodiments of the invention, the circumferential electrodes can be connected in patterns. A second electrode(s) is arranged so as to be isolated from said first electrodes by said first metal oxide layer. In some embodiments, the second electrode(s) is in a second layer, and in other embodiments the second electrode(s) is also within the first metal oxide layer. A containing layer, e.g., a thin layer of glass, quartz, or plastic, seals the discharge medium (plasma) into the microcavities. In a preferred method of formation embodiment, a metal foil or film is obtained or formed with micro-holes. The foil is anodized to form metal oxide. One or more self-patterned metal electrodes are automatically formed and buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity in a plane(s) transverse to the microcavity axis, and can be electrically isolated or connected. Preferred embodiments provide inexpensive microplasma device electrode structures and a fabrication method for realizing microplasma arrays that are lightweight and scalable to large areas. Electrodes buried in metal oxide and complex patterns of electrodes can also be formed without reference to microplasma devices—that is, for general electrical circuitry.