Buried Component Board Resin Layering Method

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Solution Overview

Problem

In the manufacturing of electronic device boards, components buried in resin often move to unexpected positions due to resin softening, leading to issues like short-circuits and reduced reliability, particularly when thick uncured resin layers are used.

Innovation Solution

A method involving a three-layer board structure with thin film components, where first and second resin layers are formed on both surfaces of a core with wiring patterns, and components are fixed to the second resin layer with the wiring pattern buried before curing, reducing the thickness of uncured resin and minimizing component displacement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If thick uncured resin layers are used to embed components, then component embedding is achieved, but component movement occurs due to resin softening

Engineering Contradiction:

Improveresin layer thicknessVSAvoidcomponent position stability

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The resin layer is divided into multiple segments (first resin layer, second resin layer, third resin layer) with different functions. The first resin layer provides initial embedding, the second resin layer provides structural support during curing, and the third resin layer completes the embedding. This segmentation allows each layer to be optimized for its specific function, preventing component movement while achieving complete embedding.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Components are preliminarily fixed to the first resin layer before the second resin layer is applied. This preliminary action secures components in their correct positions before the full curing process, preventing movement during subsequent manufacturing steps. The first resin layer acts as a preliminary fixing medium that holds components steady.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If components are fixed to resin layers, then component embedding is achieved, but manufacturing complexity increases

Engineering Contradiction:

Improvecomponent embedding qualityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Multiple resin layer applications and curing steps are merged into a single integrated manufacturing process. The first, second, and third resin layers are applied in sequence with curing steps, but all within one continuous manufacturing flow. This merging reduces the need for separate assembly operations and simplifies the overall manufacturing complexity while maintaining high embedding quality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The first resin layer serves as an intermediary medium between the component and the subsequent resin layers. It provides initial adhesion and positioning, allowing subsequent layers to be applied uniformly. This intermediary role simplifies the manufacturing process by eliminating the need for complex separate fixing operations.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If resin is applied to bury wiring patterns, then wiring patterns are protected, but air pockets may remain affecting reliability

Engineering Contradiction:

Improvewiring pattern protectionVSAvoidair pockets in resin

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The resin application and curing process is performed in periodic stages with multiple resin layers. Each layer is applied, cured, and then the next layer is applied. This periodic action allows air pockets to be progressively eliminated as each new layer pushes remaining air outward during application, ensuring complete wiring pattern protection without trapped air pockets.

Inventive Principle:

Principle #19Periodic action

Solution Approach 2:

The viscosity and application parameters of the resin are optimized for each layer. The first resin layer has parameters suitable for initial embedding, the second resin layer has parameters optimized for air pocket elimination, and the third resin layer completes the protection. By changing resin parameters between layers, air pockets are prevented while maintaining wiring pattern protection.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces component movement, lowering the generation rate of defective products and ensuring complete resin filling in wiring patterns, thereby enhancing reliability and capacitance, with a generation rate of defective products reduced to 10% compared to 80-90% in comparative examples.

Implementation Method 1

where first and second resin layers are formed on both surfaces of a core with wiring patterns, and components are fixed to the second resin layer with the wiring pattern buried before curing

Methodology Applied

Scientific EffectCuring: Phase Change

Data Source

PatentUS10396020B2Method of manufacturing board

Publication Date: 2019.08.27 FM HOLDINGS CO LTD

AI summary

A board includes a plate-shaped member having a first wiring pattern, a first resin layer formed on a first surface of the plate-shaped member, the first surface having the first wiring pattern, a second resin layer stacked on the first resin layer, and a component fixed to the second resin layer in which a second wiring pattern formed on a second surface of the component is buried.