Buried Conductive Region Packaging for Galvanically Isolated Dice
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Solution Overview
Problem
Existing packaged electronic systems face challenges in achieving adequate galvanic isolation between devices operating at different voltages, with current approaches either being inflexible or prone to parasitic components and cross-talk, especially when using advanced isolation technologies or high-capacitance methods.
Innovation Solution
A packaged electronic system utilizing a buried conductive region within an organic support, capacitively coupled with contact structures to provide a galvanic-coupling structure between dice, allowing for efficient transmission of common mode signals while maintaining high isolation levels and minimizing parasitic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection wires are used to connect isolation elements in dice, then galvanic isolation is achieved, but parasitic elements and cross-talk increase
Solution Approach 1:
The patent extracts and eliminates the connection wires that cause parasitic elements and cross-talk. By using a common substrate with integrated conductive paths instead of discrete wires connecting separate isolation elements, the harmful parasitic effects are removed while maintaining galvanic isolation functionality.
Solution Approach 2:
The patent merges the isolation elements and their connection paths into a single integrated structure on a common substrate. This consolidation eliminates the need for separate connection wires between discrete isolation elements, thereby reducing parasitic elements and cross-talk while achieving galvanic isolation.
2Object-generated harmful factors
If two-dice approach is used with short connection wires, then parasitic elements are reduced, but design flexibility is limited
Solution Approach 1:
The common substrate serves multiple functions: it provides mechanical support, electrical connections, and galvanic isolation simultaneously. This multi-functional approach enables design flexibility without requiring separate components, allowing the system to adapt to different configurations while maintaining low parasitic elements.
Solution Approach 2:
The common substrate acts as an intermediary that integrates multiple isolation elements and their connections in a unified structure. This mediator approach provides design flexibility by allowing various configurations of isolation elements on the same substrate while maintaining low parasitic elements through integrated routing.
3Adaptability or versatility
If three-dice approach is used with isolated isolation element, then design flexibility is improved, but connection wires become longer causing increased cross-talk
Solution Approach 1:
The patent combines multiple isolation elements and their connection paths into a single integrated structure on a common substrate. This merging eliminates the need for long connection wires between separate isolation elements, thereby reducing cross-talk while maintaining the design flexibility to configure isolation elements as needed.
4Reliability
If shielding coatings are applied to wires, then isolation is improved, but manufacturing complexity and repeatability problems increase
Solution Approach 1:
The patent extracts and eliminates the need for shielding coatings by removing the discrete wires that require shielding. The integrated substrate structure provides inherent isolation without requiring additional shielding layers, thereby improving manufacturing repeatability while maintaining high isolation levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enables high isolation between devices operating at varying voltages, reducing parasitic elements and cross-talk, while allowing for flexible design and use of advanced isolation technologies, thus improving the overall performance and efficiency of the electronic system.
Implementation Method 1
A packaged electronic system utilizing a buried conductive region within an organic support, capacitively coupled with contact structures to provide a galvanic-coupling structure between dice
Data Source
Figure 1~4
Figure 5~5A
Figure 6~8
AI summary
A packaged electronic system having a support (55) formed by an insulating organic substrate housing a buried conductive region (56) that is floating. A first die (51) is fixed to the support and carries, on a first main surface, a first die contact region (67) capacitively coupled to a first portion of the buried conductive region. A second die (52) is fixed to the support and carries, on a first main surface, a second die contact region (67) capacitively coupled to a second portion of the buried conductive region. A packaging mass (77) encloses the first die (51), the second die (52), the first die contact region, the second die contact region, and, at least partially, the support (55).