Buried Inductor Formation in High Resistivity Substrate
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Solution Overview
Problem
Existing methods for buried inductors in ultra-high resistivity wafers for SOI RF applications require an additional insulating layer, increasing manufacturing costs and complexity, as they do not fully utilize the high resistivity properties of the substrate.
Innovation Solution
Buried inductors are formed directly in the high resistivity substrate without an insulating layer, leveraging the substrate's properties for electrical isolation, thereby simplifying the formation process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating layer is formed in the trench between the substrate and the inductor, then electrical isolation is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent removes the insulating layer from the trench structure, extracting the unnecessary component while relying on the ultra-high resistivity substrate's inherent electrical isolation properties. This simplifies the manufacturing process while maintaining the required electrical isolation performance.
Solution Approach 2:
The ultra-high resistivity substrate provides self-isolation capabilities without requiring additional insulating layers. The substrate's inherent high resistivity property serves the isolation function automatically, eliminating the need for separate insulating layer formation processes.
2Reliability
If an insulating layer is formed in the trench between the substrate and the inductor, then electrical isolation is improved, but manufacturing cost increases
Solution Approach 1:
The patent eliminates the insulating layer formation step, removing the associated material costs and processing expenses. The ultra-high resistivity substrate's natural properties provide the necessary isolation without additional manufacturing expenditures.
Solution Approach 2:
The substrate's ultra-high resistivity property provides self-isolation, eliminating the need for separate insulating layer materials and formation processes, thereby reducing manufacturing costs while maintaining electrical isolation performance.
3Reliability
If an insulating layer is formed in the trench, then substrate insulation is improved, but process time increases
Solution Approach 1:
The patent removes the insulating layer formation step from the manufacturing sequence, eliminating the time required for depositing, patterning, and etching the insulating layer. The ultra-high resistivity substrate provides inherent isolation without these time-consuming processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and enhances the efficiency of buried inductors by eliminating the need for additional insulation, resulting in higher quality factors and improved inductive performance.
Implementation Method 1
a high resistivity substrate and a buried inductor formed directly in the high resistivity substrate and devoid of an insulating layer therebetween
Data Source
AI summary
A design structure is embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes a high resistivity substrate and a buried inductor formed directly in the high resistivity substrate and devoid of an insulating layer therebetween.