Buried Metal Back Electrode Layout for Compact Spin Qubits

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Solution Overview

Problem

Existing quantum devices face challenges in integrating a back electrostatic control electrode without inducing residual dopants or method complexity, and in positioning conductive lines close to semiconducting islands without increasing device size.

Innovation Solution

A quantum device with a back conductive electrode positioned vertically aligned with an insulating region between semiconducting portions, using a metal material-based region in the semiconductor-on-insulator substrate, allowing for precise placement and integration of additional control gates, and enabling efficient electrostatic coupling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the back gate is made of semiconductor material with heavy doping to remain conductive at very low temperatures, then the gate can be functional, but residual dopants are induced in the semiconducting layer which is incompatible with quantum device operation

Engineering Contradiction:
Improveconductive functionality of back gateVSAvoidresidual dopants in semiconducting layer
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the material parameter of the back gate from heavily doped semiconductor to metal, fundamentally altering the conductivity mechanism from dopant-based to intrinsic metallic conduction, thereby achieving low-temperature functionality without residual dopants

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses a metal material that replicates the desired conductive property at low temperatures without requiring the dopant structure, effectively copying the functional requirement through a different material system

Inventive Principle:
Principle #26Copying

2Reliability

If additional control gates are disposed above the quantum islands, then electrostatic control is improved, but the overall device size increases

Engineering Contradiction:
Improveelectrostatic control capabilityVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent moves the back control electrode to a different spatial dimension (below the quantum islands in the vertical direction) rather than adding it laterally above the islands, thereby maintaining control capability while avoiding lateral size expansion

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The back control electrode is nested within the substrate structure below the quantum islands, utilizing the vertical space within the existing device footprint rather than expanding the lateral boundaries

Inventive Principle:
Principle #7Nested doll (Nesting)

3Reliability

If a wafer transfer step with a pre-doped zone is used to make the back gate, then the back gate can be conductive, but the method becomes complex and induces significant variability

Engineering Contradiction:
Improveconductive property of back gateVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the back gate formation step from the complex wafer transfer and pre-doping sequence, implementing it as a direct metal deposition and alloying process within the existing substrate structure, thereby eliminating the need for separate wafer processing steps

Inventive Principle:
Principle #2Taking out (Extraction)

4Reliability

If conductive lines are juxtaposed next to or disposed above the semiconducting islands for RF signal transmission, then spin manipulation capability is improved, but the overall device size increases

Engineering Contradiction:
Improvespin manipulation capabilityVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent positions the RF conductive line in the vertical dimension below the quantum islands within the substrate, rather than laterally adjacent to or above the islands, enabling spin manipulation while maintaining a compact lateral footprint

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This arrangement frees up space above the quantum islands, optimizes ESR coupling, and supports operation at very low temperatures, while avoiding heavy doping and method complexity.

Implementation Method 1

a back control electrode arranged below the level in which the islands are located

Methodology Applied
Scientific EffectElectrostatic control: Electrostatics

Implementation Method 2

said insulating layer is arranged between said support layer and said surface layer

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 3

This type of quantum device generally operates at very low temperatures

Methodology Applied
Scientific EffectCryogenic operation: Cryogenics

Implementation Method 4

the metal region may also be able to adopt superconducting properties

Methodology Applied
Scientific EffectSuperconductivity: Superconductivity

Implementation Method 5

electrons are confined by field effect below gate electrodes similar to those of transistor structures

Methodology Applied
Scientific EffectField effect: Electric Field

Data Source

PatentUS12475395B2Quantum device integrating a buried metal electrode
Publication Date: 2025.11.18 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
  • US12475395B2 patent drawing
  • US12475395B2 patent drawing
  • US12475395B2 patent drawing

AI summary

A Qbit spin quantum device includes juxtaposed first and second semiconducting portions, the semiconducting portions being formed in a surface layer of a semiconductor-on-insulator type substrate and disposed on an insulating layer of the substrate, the substrate being fitted with a semiconducting support layer such that the insulating layer is arranged between the support layer and the surface layer, and several pairs of front control gates, each pair being formed respectively of first and second front control gates covering a region of the first and second semiconducting portions to form first and second quantum islands, respectively. An insulating region is provided between the first and second quantal islands to enable electrostatic coupling between the first and second quantum islands. The quantum device includes a back conductive electrode vertically aligned with a coupling insulating region and being formed of a region of metal-semiconductor material alloy arranged in the support layer.