Buried Optoelectronic Chip Substrate for Compact Optical Transmission
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Solution Overview
Problem
Conventional optical transduction devices have limitations in integration due to their thickness, which hinders their compact assembly in devices like smartphones, and existing designs often suffer from inefficiencies in signal transmission and reception.
Innovation Solution
The device features a substrate with optoelectronic chips buried within, covered by a transparent material-filled opening and an opaque cover with integrated transparent elements, allowing for a compact design and efficient optical signal transmission and reception through multiple regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional optical transduction devices are used, then optical signal transmission and reception can be achieved, but the total thickness is too large for compact assembly in devices like smartphones
Solution Approach 1:
The optoelectronic chip is buried within the substrate, with the transparent material filling the opening and the cover encapsulating the entire structure. This nested configuration allows multiple functional layers to occupy the same spatial footprint, significantly reducing the overall device thickness while maintaining all necessary optical transmission and reception pathways.
Solution Approach 2:
The invention transitions from a planar arrangement to a three-dimensional buried configuration. By positioning the optoelectronic chip within the substrate volume rather than on the surface, and using transparent elements that extend through the cover, the design exploits the third dimension to reduce footprint thickness while preserving optical functionality.
2Volume of moving object
If the device is made compact with buried chips, then integration in smartphones is improved, but manufacturing complexity increases
Solution Approach 1:
The substrate is designed with pre-formed openings before the optoelectronic chip is embedded. The transparent material is prepared to fill these openings, and the cover is designed with integrated transparent elements positioned in advance. This preliminary structuring simplifies the subsequent assembly process despite the complex final configuration.
Solution Approach 2:
The invention combines multiple functions into integrated structures: the cover serves both as a protective enclosure and as a carrier for transparent optical elements; the substrate provides both structural support and optical pathways; and the transparent material simultaneously fills voids and creates optical transmission channels. This merging reduces the number of discrete components and assembly steps.
3Reliability
If transparent elements are placed in the cover, then optical signal transmission is improved, but the cover structure becomes more complex
Solution Approach 1:
The cover is designed to perform multiple functions simultaneously: it provides mechanical protection for the buried optoelectronic chip, serves as a structural framework, and integrates transparent optical elements that enable signal transmission. By making the cover a multi-functional component rather than a simple enclosure, the design reduces overall device complexity while improving optical performance.
Solution Approach 2:
The cover structure combines opaque structural material with integrated transparent optical elements, creating a composite structure that simultaneously provides mechanical strength and optical transmission pathways. This composite approach allows the cover to fulfill multiple roles without requiring separate components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a significantly reduced total thickness, enabling better integration in compact assemblies and improving signal reception and transmission efficiency by utilizing buried optoelectronic chips and strategically placed transparent elements.
Implementation Method 1
The substrate comprises an opening, preferably filled with a transparent material, above a first optical transduction region of the chip... the cover comprises an element, preferably transparent, crossing the cover above the first region
Data Source
AI summary
A device includes a substrate and an optoelectronic chip buried in the substrate. The substrate may include an opening above a first optical transduction region of the first optoelectronic chip and above a second optical transduction region of a second optoelectronic chip.