Buried PCB Patch Antenna for Low-Loss mmWave Phased Arrays
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Solution Overview
Problem
The manufacturing of mmWave phased array antennas for 5G systems faces challenges due to manufacturing tolerance limitations, signal loss from conventional finishes, and high costs associated with suitable plating alternatives, which affect performance and cost-effectiveness.
Innovation Solution
A mmWave phased array antenna design featuring a buried patch antenna radiating element on a PCB structure with a stack of dielectric and conductive layers, including a beamforming IC and a thin dielectric layer over the radiating element to minimize signal attenuation and prevent capacitive coupling, using microvias and a localized patch feed to enhance signal propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional finishes (ENIG, OSP, silver, gold plating) are used on exposed copper for mmWave PCBs, then manufacturing cost and reliability are affected, but signal loss increases and manufacturing cost increases
Solution Approach 1:
The patent extracts the radiating patch element from the conventional PCB surface and embeds it within the dielectric substrate. This extraction eliminates the need for exposed copper surfaces that require costly and signal-loss-prone finishes, while maintaining the essential radiating function through the dielectric-embedded structure
Solution Approach 2:
The patent replaces expensive plating materials (silver, gold) with a cost-effective alternative approach using standard PCB dielectric materials and processes. The buried patch structure achieves mmWave performance without relying on expensive conductive plating, making high-volume low-cost manufacturing feasible
2Manufacturing precision
If precise manufacturing is implemented to meet manufacturing tolerance requirements, then antenna performance is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent changes the fundamental parameter of how the radiating element is constructed - transitioning from surface-mounted copper traces requiring precise etching to a dielectric-embedded structure. This parameter change allows standard PCB manufacturing tolerances to suffice, eliminating the need for specialized high-precision fabrication processes
3Ease of manufacture
If copper is exposed on the PCB surface for radiating elements, then manufacturing is easier, but oxidation occurs leading to dimension changes and performance degradation
Solution Approach 1:
The radiating copper elements are extracted from the exposed surface environment and embedded within the protective dielectric substrate. This extraction eliminates direct exposure to oxidizing atmospheres while maintaining the radiating functionality through the embedded structure's interaction with electromagnetic fields
Solution Approach 2:
The dielectric substrate serves as an intermediary protective layer between the copper radiating elements and the external environment. This intermediary prevents direct contact with oxygen and moisture, eliminating oxidation while allowing the copper to maintain its radiating function through the dielectric interface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise and cost-effective manufacturing of mmWave phased array antennas with reduced signal loss and improved reliability, suitable for high-volume production while maintaining signal integrity.
Implementation Method 1
one of the dielectric layers is formed over the radiating element so that the radiating element is buried
Data Source
AI summary
A mmWave phased array antenna that has particular application to be used in a 5G radio. The antenna includes a PCB structure having a plurality of dielectric layers and conductive layers. A beamforming IC is formed on one side of the PCB structure and a patch antenna radiating element is formed at an opposite side of the PCB structure from the beamforming IC, where one of the dielectric layers is formed over the radiating element so that the radiating element is buried.