Buried Power Supply Panel Layout for FAB Cable and Heat Constraints
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing power supply systems in semiconductor manufacturing facilities have inefficient space utilization and complex cable arrangements, which reduce efficiency and complicate maintenance due to the surface-mounted power supply panels and lengthy, complicated electric cables.
Innovation Solution
A buried power supply panel with a heat dissipation system and independently formed cable connection portions on upper and lower surfaces, anchored to the facility's structure, is integrated into the fabrication facility's wall or ceiling, allowing for non-contact power supply to overhead hoist transport vehicles and improving space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the power supply panel is simply disposed in a structure that is not buried in a sub-FAB, then the power supply can be easily installed, but space utilization efficiency is reduced and electric cables become complicatedly arranged
Solution Approach 1:
The power supply panel is nested within a buried space formed in the sub-FAB wall, with the front portion exposed to the main FAB. This nesting approach integrates the power supply panel into the existing wall structure, eliminating the need for separate mounting spaces and simplifying cable routing through the wall thickness rather than across the FAB ceiling.
Solution Approach 2:
The invention transitions from a surface-mounted configuration to a buried configuration by utilizing the wall thickness dimension. The power supply panel is positioned within the wall structure rather than on the ceiling surface, changing the spatial dimension from two-dimensional surface mounting to three-dimensional embedded installation, which reduces cable complexity.
2Ease of manufacture
If the power supply panel is simply disposed in a structure that is not buried in a sub-FAB, then the installation is straightforward, but space utilization efficiency is reduced
Solution Approach 1:
The power supply panel is nested within the wall structure of the sub-FAB, utilizing the wall thickness as the installation space. This eliminates the need for additional ceiling space or separate mounting areas, thereby improving space utilization efficiency while maintaining installation simplicity through the standardized buried configuration.
Solution Approach 2:
The installation moves from the ceiling plane to the wall thickness dimension, utilizing the third dimension (depth into the wall) for power supply panel placement. This dimensional transition frees up ceiling space for other uses while providing adequate installation space for the power supply panel within the wall structure.
3Device complexity
If the power supply panel is buried in a wall, then space utilization efficiency is improved and cable arrangement is simplified, but heat dissipation becomes more difficult
Solution Approach 1:
The front portion of the power supply panel, which contains the heat-generating components, is exposed to the main FAB while the rear portion remains buried in the sub-FAB wall. This local quality differentiation allows the exposed front portion to serve as a heat dissipation interface with adequate airflow, while the buried rear portion provides structural integration and cable routing advantages.
Solution Approach 2:
The power supply panel is segmented into a front portion and a rear portion, with different functional requirements. The front portion is positioned to facilitate heat dissipation and cable connection, while the rear portion is embedded in the wall for structural integration. This segmentation allows each portion to optimize its specific function despite the buried configuration.
4Area of stationary object
If the power supply panel is buried in a wall, then space utilization efficiency is improved, but maintenance of electric cables becomes more difficult
Solution Approach 1:
The cable connection portion is positioned at the front portion of the power supply panel, which is exposed to the main FAB. This local quality differentiation ensures that the cable connection interface remains accessible for maintenance while the bulk of the power supply panel remains buried to improve space utilization. Maintenance personnel can access the cable connection portion without requiring access to the buried portion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances space utilization efficiency, simplifies cable arrangements, and facilitates maintenance by burying power supply components, reducing cable length and complexity while ensuring effective heat dissipation and stable power delivery.
Implementation Method 1
a heat dissipation portion including an inlet through which air is suctioned into the power supply body by a heat dissipation fan installed in the power supply body, and an outlet through which air is discharged from the power supply body externally by the heat dissipation fan
Data Source
AI summary
A power supply panel according to the present disclosure is buried in a buried space having a groove structure or a hole structure, formed in a wall of a fabrication facility (FAB), such that a front portion is disposed on an exposed surface of the buried space, and includes a power supply body supplying power; and a heat dissipation portion formed in the front portion of the power supply body.