Buried Rail Power Delivery in FinFET ICs for Reliable Transmission
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Solution Overview
Problem
Existing integrated circuit devices face challenges in reliably transmitting power due to the limitations of their power delivery networks, particularly in highly integrated circuits where power distribution efficiency is compromised.
Innovation Solution
The integrated circuit device incorporates a substrate with fin-type active regions, a device separation layer, source/drain regions, conductive plugs, power wiring lines, buried rails, and power vias to enhance power transmission efficiency, utilizing a layered structure with insulating barriers and conductive plugs to connect these components effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional power delivery networks are used in highly integrated circuit devices, then device integration is achieved, but power transmission reliability deteriorates
Solution Approach 1:
The patent introduces a buried rail structure located beneath the substrate, creating a new dimensional pathway for power delivery. This subsurface power transmission path allows power to reach highly integrated regions without relying solely on surface-level wiring, thereby maintaining reliability as integration increases
Solution Approach 2:
The buried rail acts as an intermediary power transmission element between the power supply and the highly integrated circuit regions. It mediates power delivery by providing a dedicated, low-resistance pathway that bypasses the limitations of conventional surface wiring, ensuring reliable power transmission despite high integration density
2Device complexity
If conventional power wiring is used, then device complexity is reduced, but power distribution efficiency deteriorates
Solution Approach 1:
The power delivery system is segmented into multiple functional components: power wiring lines on the surface, buried rails beneath the substrate, and via holes for vertical connection. This segmentation allows each component to be optimized for its specific function, with the buried rail providing a dedicated low-resistance path that improves power distribution efficiency without significantly increasing overall device complexity
3Area of stationary object
If power wiring lines are extended to reach all regions, then power coverage is improved, but resistance increases
Solution Approach 1:
Instead of extending surface power wiring lines across the entire device area (which would increase resistance), the patent utilizes a subsurface dimension by placing buried rails beneath the substrate. This allows power to reach distant and highly integrated regions through a separate, optimized pathway that maintains low resistance while providing comprehensive power coverage
Data Source
AI summary
An integrated circuit device includes a substrate, having a front surface and a rear surface opposite to each other, and a fin-type active region defined by a trench in the front surface, a device separation layer filling the trench, a source/drain region on the fin-type active region, a first conductive plug arranged on the source/drain region and electrically connected to the source/drain region, a power wiring line at least partially arranged on a lower surface of the substrate, a buried rail connected to the power wiring line through the device separation layer and decreasing in horizontal width toward the power wiring line, and a power via connecting the buried rail to the first conductive plug.