Partially Buried Trace Substrates to Prevent Peeling
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Solution Overview
Problem
Conductive patterns in semiconductor devices, such as embedded trace substrates, tend to peel away from the substrate, leading to open circuits and reduced reliability, especially in miniaturized electronic components like those found in handheld devices.
Innovation Solution
The method involves creating a pattern of conductive traces above a dielectric layer and mechanically pressing the lower portions of these traces into the layer, either within a primer layer or directly into the dielectric layer, to bury them securely, thereby reducing the likelihood of peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive traces are placed on the substrate surface, then electrical connectivity is achieved, but the traces peel away from the substrate leading to open circuits
Solution Approach 1:
The conductive traces are nested within the dielectric layer rather than remaining on the surface. The mechanical pressing process embeds the traces into the dielectric material, creating a nested structure where the trace is partially surrounded by the dielectric layer, similar to a nested doll configuration. This nesting provides mechanical support and prevents peeling.
Solution Approach 2:
The mechanical pressing action is applied in advance to embed the conductive traces into the dielectric layer before final assembly and testing. This preliminary embedding action ensures that the traces are securely attached before the package undergoes subsequent processing or drop tests, preventing future peeling issues.
2Reliability
If conductive traces are mechanically pressed into the dielectric layer, then peeling is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent replaces complex chemical bonding processes or multi-step assembly procedures with a straightforward mechanical pressing operation. This mechanical approach simplifies the fabrication process while achieving reliable trace attachment, substituting potentially complex systems with a simpler mechanical solution.
Solution Approach 2:
The mechanical pressing process changes physical parameters such as pressure, temperature, and time to achieve trace embedding. By controlling these parameters, the process achieves reliable attachment without requiring complex multi-step procedures, managing complexity through parameter optimization rather than process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the secure attachment of conductive elements, improving the reliability of the traces and allowing electronic devices to withstand drop tests without trace disconnection, thus ensuring stable performance in packaged assemblies.
Implementation Method 1
mechanically pressing on the pattern of conductive traces such that lower portions of the conductive traces are buried in the dielectric layer
Data Source
AI summary
Certain aspects of the present disclosure generally relate to an embedded trace substrate with partially buried traces, methods for fabrication thereof, and apparatus comprising such an embedded trace substrate. One example method of fabricating an embedded trace substrate generally includes creating a pattern of conductive traces above a dielectric layer and mechanically pressing on the pattern of conductive traces such that lower portions of the conductive traces are buried in the dielectric layer.