Buried Wiring ESD Protection Layout for Semiconductor I/O
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Solution Overview
Problem
Configurations of semiconductor devices incorporating buried power supply wirings for ESD protection circuits have not been thoroughly studied, limiting the implementation of effective ESD protection in semiconductor devices.
Innovation Solution
A semiconductor device design that includes a substrate with a circuit region featuring a power supply wiring, a ground wiring, and a signal line, with a diode connected between the signal line and one of the power supply or ground wirings, where the diode has impurity regions of different conductive types, allowing for the implementation of an ESD protection circuit using buried wirings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If power supply wirings are provided above substrates, then ease of manufacture is improved, but device area increases
Solution Approach 1:
The patent transitions power supply wirings from a planar configuration (above substrate) to a three-dimensional buried structure (within substrate), utilizing the vertical dimension to reduce the horizontal area occupied by power supply networks while maintaining manufacturing feasibility through established semiconductor fabrication processes
2Area of stationary object
If power supply wirings are buried in substrates, then device area is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent combines the power supply wiring formation process with existing substrate processing steps, integrating buried wiring creation into the standard fabrication sequence rather than adding separate complex manufacturing stages, thereby reducing overall manufacturing complexity while achieving area reduction
3Reliability
If ESD protection circuits are implemented with traditional configurations, then reliability is improved, but device area increases
Solution Approach 1:
The patent embeds ESD protection circuit elements within the buried power supply wiring structure itself, nesting the protection functionality inside the existing power distribution framework, which reduces the overall area required for ESD protection while maintaining the reliability benefits of dedicated protection circuits
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the implementation of an ESD protection circuit with buried wirings, enhancing the miniaturization and current uniformity of semiconductor devices while reducing parasitic capacitance and improving layout flexibility.
Implementation Method 1
The I/O cell region may be provided with an ESD (Electro-Static Discharge) protection circuit to suppress breakdown of the internal circuit region due to static electricity
Data Source
AI summary
A semiconductor device includes a substrate; a circuit region provided with a power supply wiring, a ground wiring, and a signal line; and a first diode connected between the signal line and a first wiring. The first wiring is one of the power supply wiring and the ground wiring. The first diode includes a first impurity region of a first conductive type, electrically connected to the signal line, and a second impurity region of a second conductive type, different from the first conductive type, electrically connected to the first wiring. The signal line, the first wiring, or both is formed in the substrate.