Burn-In Board Alignment Frame With Progressive Thermal Sealing
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Solution Overview
Problem
Misalignment and thermal sealing issues between burn-in boards and receiving connectors due to uneven ground surfaces, leading to potential damage and leakage in burn-in processes, and the need for cumbersome ground surface modifications when relocating burn-in chambers.
Innovation Solution
A burn-in apparatus with interchangeable frames and cooperating alignment and thermal insulation elements that lift the frame off the ground, ensuring precise alignment and sealing by using rollers and complementary thermal insulation side elements, minimizing wear and tear, and eliminating the need for ground surface modifications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the burn-in chamber is directly placed on an uneven ground surface, then the apparatus can be easily installed and relocated, but misalignment between burn-in boards and receiving connectors occurs leading to potential damage
Solution Approach 1:
The patent introduces an interchangeable frame with a thermal insulation base as an intermediary component between the burn-in chamber and the ground surface. This frame includes alignment elements that actively compensate for ground unevenness, allowing the chamber to be easily relocated while maintaining precise alignment between burn-in boards and receiving connectors through the mediating function of the frame's alignment mechanism
2Reliability
If thermal insulation side elements are made high to ensure complete sealing, then thermal sealing is improved, but wear and tear increases during docking and undocking operations
Solution Approach 1:
The patent makes the thermal insulation side elements dynamic by providing them with complementary characteristics that allow progressive overlap during docking. The elements transition from a clearance gap state during insertion to an abutting fit state when fully docked, enabling complete thermal sealing while minimizing wear through controlled, progressive contact rather than rigid, continuous friction
Solution Approach 2:
The patent changes the physical parameters of the thermal insulation side elements by providing complementary characteristics (such as tapered profiles or graduated heights) that allow the overlap parameter to vary during the docking process. This parameter change enables the system to achieve complete sealing at the docked position while reducing contact pressure and wear during the movement phase
3Manufacturing precision
If the frame is firmly fixed to the ground to prevent misalignment, then alignment precision is improved, but relocation becomes cumbersome requiring ground surface modifications
Solution Approach 1:
The patent segments the support system into modular components: the burn-in chamber, the interchangeable frame with thermal insulation base, and the alignment elements. This segmentation allows the frame to be easily removed and relocated to different positions or facilities without modifying the ground surface, while the alignment elements on the frame maintain precise alignment during each relocation, avoiding the need for complex ground modifications
Data Source
Figure 1A~1D
Figure 2A~2D
Figure 3A~3B
AI summary
The present disclosure relates to burn-in apparatus, transfer method, burn-in chamber, and interchangeable frame thereof for semiconductor devices burn-in process. The burn-in apparatus comprises a burn-in chamber with an incomplete base which is to be completed and thermally insulated in cooperation with a thermal insulation base of at least one interchangeable frame which is to be removably moved into and docked in the chamber to complete the burn-in apparatus. Cooperating alignment elements are respectively arranged at the frame and the chamber, and configured to progressively and movably couple to each other to lift the frame to bring a set of burn-in boards that are supported on the frame into alignment for insertion into a set of receiving connectors in the chamber. Cooperating thermal insulation side elements may be respectively arranged at the frame and the chamber, and include complementary characteristics configured to provide a clearance gap between the thermal insulation side elements when they partially overlap each other and an abutting fit when they substantially or fully overlap each other.