Burn-in Board Socket Latch Head Heating Elements
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Solution Overview
Problem
Conventional burn-in test ovens using convective heating struggle to maintain uniform temperature across memory devices mounted on a burn-in board, leading to uneven temperature stressing of devices near the edges versus the center, which can result in non-functional memory devices due to voltage and temperature stress.
Innovation Solution
Integration of local heating elements into each socket's latch heads on the burn-in board, which receive electrical current to provide controlled and even heating to each memory device, ensuring consistent temperature across all devices during testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If convective heating is used to heat the burn-in board, then the overall temperature can be elevated, but the temperature distribution across the board becomes non-uniform
Solution Approach 1:
The patent applies local quality by integrating individual heating elements into each socket's latch head, allowing each memory device to receive customized heating. This ensures that each device experiences uniform temperature stress regardless of its position on the burn-in board, resolving the temperature distribution non-uniformity caused by convective heating.
Solution Approach 2:
The heating system is segmented into multiple independent heating elements, with each element associated with a specific socket. This segmentation allows independent temperature control for each memory device, eliminating the temperature gradients that occur with centralized convective heating.
2Quantity of substance
If multiple memory devices are mounted on a large burn-in board, then testing capacity increases, but temperature uniformity across devices deteriorates
Solution Approach 1:
The heating system is divided into multiple independent heating elements, one for each socket. This segmentation enables each memory device to be heated independently and uniformly, regardless of the board size or number of devices being tested simultaneously.
Solution Approach 2:
Each socket is equipped with its own heating element, providing localized temperature control. This ensures that each memory device receives consistent temperature stress tailored to its specific position on the board, maintaining temperature uniformity even as the number of devices increases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures uniform and efficient heating of memory devices, reducing the risk of over- or under-stressing and improving the reliability of burn-in testing by maintaining consistent elevated temperatures, thereby enhancing the operational integrity of memory devices.
Implementation Method 1
a heating element integrated into the at least one latch head, the heating element configured to heat the memory device
Implementation Method 2
the at least one latch head clamps the memory device in the socket
Data Source
AI summary
A burn-in board for testing the operational integrity of memory devices includes local heating elements for each memory device under test. Each socket on the burn-in board may include a pair of opposed latch heads which move between open positions allowing a memory device to be mounted in the socket, and closed positions where the latch heads rest against the memory device to secure the device in the socket. Local heating elements may be integrated into the latch heads to ensure even heating of each memory device in the burn-in board.