Burn-In Board Power Segmentation for Accurate Chip Testing
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Solution Overview
Problem
Conventional burn-in testing apparatuses face challenges in obtaining accurate input voltage and current for multiple chips under test, leading to unreliable test results and complex error identification due to shared DC power supplies.
Innovation Solution
A testing apparatus and burn-in device design that allows individual connection of each chip to a dedicated DC power supply module, with a processing device controlling temperature and test processes, ensuring precise voltage and current input through separate power and signal contact structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single DC power supply is connected to multiple chips under test simultaneously, then device complexity is reduced, but measurement precision and reliability of test results deteriorate due to inability to obtain accurate input voltage and current for each chip
Solution Approach 1:
The patent divides the single DC power supply into multiple independent DC power supply modules, where each module is dedicated to powering a specific chip under test. This segmentation allows for independent measurement and control of voltage and current for each chip, resolving the measurement precision issue while maintaining manageable system complexity through modular design.
2Ease of operation
If a single DC power supply is shared by multiple chips, then ease of operation is improved, but reliability of test results worsens due to difficulty in identifying error sources
Solution Approach 1:
By assigning dedicated DC power supply modules to each chip, the patent creates independent power chains that eliminate the ambiguity of error source identification. When errors occur, the isolated modular structure allows operators to quickly pinpoint the specific chip or power supply module responsible, maintaining ease of operation while significantly improving test result reliability.
Solution Approach 2:
The patent introduces independent DC power supply modules as intermediaries between the power source and each chip under test. These intermediary modules provide isolation and individual control, allowing for reliable error identification while maintaining straightforward operation through standardized interfaces.
3Productivity
If multiple chips are connected to the same DC power supply, then productivity is improved through parallel testing, but measurement precision deteriorates due to voltage drop and simultaneous failure risks
Solution Approach 1:
The patent segments the power supply system into dedicated modules for each chip, enabling parallel testing while maintaining precise voltage and current control for each individual chip. This eliminates the voltage drop and interference issues associated with shared power supplies, allowing high productivity without sacrificing measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures reliable test results by accurately controlling voltage and current to each chip, reducing the risk of voltage drop and simultaneous chip failure, and facilitating real-time monitoring and recordkeeping.
Implementation Method 1
the processing device is configured to control the temperature adjustment device to increase or decrease a temperature of the at least one chamber to the predetermined temperature
Implementation Method 2
each of the power supply contact structures is connected to each of the DC power supply modules through the at least one mating connector
Data Source
AI summary
A testing apparatus includes an apparatus body, a processing device, a temperature adjustment device, an N number of DC power supply modules, and a burn-in device. The apparatus body includes a chamber, the processing device controls the temperature adjustment device so that a temperature of the chamber reaches a predetermined temperature. The burn-in device includes a circuit board and an M number of chip carriers. When a side of the circuit board is plugged into a mating connector of the chamber, a power supply pin of a chip under test disposed on the chip carrier is electrically connected to one of the DC power supply modules. The processing device performs a test process to the chip under test through a testing circuit. The testing circuit is not disposed on the circuit board and is disposed in the processing device or the DC power supply module.