Burn-in Socket Adapter for IC Package Size Adaptation
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Solution Overview
Problem
Existing burn-in sockets require costly and time-consuming mold modifications to accommodate IC packages of different dimensions, limiting production efficiency and increasing costs due to the need for separate sockets for each dimension.
Innovation Solution
A burn-in socket with an adapter that includes a loading board and a detachable positioning board, allowing the same socket to be adapted for various IC package sizes by swapping the positioning board, thereby reducing production time and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If mold modifications are made to accommodate different IC package dimensions, then the burn-in socket can be adapted to different package sizes, but the production time and cost increase significantly
Solution Approach 1:
The burn-in socket is divided into a base structure and a detachable positioning board. The positioning board can be removed and replaced depending on the IC package size, while the base structure remains unchanged. This segmentation allows quick adaptation without modifying the entire socket or its mold.
Solution Approach 2:
The base structure is designed with universal features that can accommodate multiple IC package sizes through the use of different positioning boards. The base includes standardized contact passageways and a receiving cavity that can work with various package dimensions, making the socket multi-functional.
2Adaptability or versatility
If mold modifications are made for each IC package dimension, then the burn-in socket can be customized for specific packages, but the production cost increases
Solution Approach 1:
The positioning board is designed as a separate, replaceable component that can be customized for different IC package sizes without modifying the expensive base structure or mold. Only the positioning board needs to be manufactured in different variants, significantly reducing overall production cost.
Solution Approach 2:
The positioning board is designed as a simpler, less expensive component compared to the base structure. Multiple positioning boards for different package sizes can be manufactured at lower cost, replacing the need for expensive custom molds for each package type.
3Reliability
If separate burn-in sockets are made for different IC packages, then each socket is optimized for its specific package, but the device complexity and inventory requirements increase
Solution Approach 1:
A single base structure is designed to work with multiple IC package types by accepting different positioning boards. This universal base reduces the number of different socket types from many (one per package) to just a few (base + different positioning boards), simplifying inventory and reducing complexity.
Solution Approach 2:
The base structure combines multiple functions: it provides the receiving cavity, contact passageways, and structural support for various IC packages. By merging these functions into a single universal base, the need for multiple specialized sockets is eliminated.
Data Source
AI summary
A burn-in socket for receiving an integral circuit (IC) package comprises a base defining a cavity for receiving the IC package and an adapter retained in the cavity. The adapter has two-pieces configuration and comprises a loading board for loading the IC package and a positioning board assembled upon the bottom plate of the loading board for positioning the IC package.