Burn-in Socket Heat Sink Gravity Retention
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Solution Overview
Problem
The existing electrical connectors for IC packages in burn-in sockets lack sufficient retention force to ensure stable electrical connections during high-temperature testing, as the elastic contacts cannot provide enough force to maintain contact under gravity.
Innovation Solution
An electrical connector design featuring a base, cover, and block-shaped heat sink, where the heat sink applies gravity force to the IC package through its weight, ensuring retention and heat radiation while maintaining electrical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If elastic contacts are used to support the IC package, then electrical connection is achieved, but retention force is insufficient under gravity
Solution Approach 1:
The patent combines the heat sink and retention element into a single integrated component. The heat sink is configured to rest on and apply downward force to the IC package, simultaneously providing thermal management and mechanical retention. This merging eliminates the need for separate retention mechanisms and ensures stable electrical contact through the combined weight and positioning of the heat sink.
2Temperature
If a water-cooled machine is used for heat radiation, then cooling capability is improved, but device complexity increases
Solution Approach 1:
The heat sink is designed to passively dissipate heat from the IC package through its own structure and positioning. By utilizing the natural weight and thermal properties of the heat sink itself, the system achieves cooling without requiring external water-cooled machines or complex active cooling systems. The heat sink serves the dual purpose of thermal management and mechanical retention, simplifying the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable and secure electrical connection and effective heat radiation for IC packages during high-temperature testing, ensuring reliable operation and preventing burnout.
Implementation Method 1
The heat sink is located above the IC package and against to the IC package so as to apply its gravity force to the IC package
Implementation Method 2
An electrical connector with a retention element also used for heat radiation
Data Source
AI summary
An burn-in socket electrically connecting an IC package to a PCB, has a base, a cover, a plurality of contacts and a block-shaped heat sink. The base defines a receiving space for the IC package. The cover is pin-jointed to one side by a pivot of the base and able to rotate around the pivot. A plurality of contacts are retained in the base and partially exposed in the receiving space. The heat sink is located above the IC package and against to the IC package so as to apply its gravity force to the IC package. A top face of the heat sink is below the top face of the cover.