Burn-in Socket Locking Mechanism for Controlled IC Force
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Solution Overview
Problem
Conventional burn-in sockets can damage IC packages due to the impulse force applied during testing, which is not suitable for simulating the real working environment effectively without causing harm.
Innovation Solution
A burn-in socket design featuring a base with terminals, a sliding plate, an actuator, and rotating locking elements that apply a controlled force to secure and release the IC package without causing damage, utilizing springs for restoration and minimizing friction to prevent destruction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional latches push IC package downwards with elastic force and impulse, then the IC package can be secured for testing, but the IC package may be destroyed due to the impulse
Solution Approach 1:
The patent changes the force application parameter from impulsive (conventional latches) to controlled pressing force (locking elements with pressing portions). The locking elements apply force gradually and controllably through their pressing portions on the side surfaces of the IC package, avoiding the harmful impulse that causes damage while still securing the package reliably for testing.
2Object-affected harmful factors
If locking elements rotate inwards to press against IC package, then controlled force is applied to secure the package, but the mechanism becomes more complex
Solution Approach 1:
The locking elements are designed to rotate dynamically between locked and unlocked positions. This rotational movement allows the pressing portions to engage with the side surfaces of the IC package, applying controlled force without damage. The dynamic rotation mechanism achieves protective function while maintaining reasonable structural complexity through the actuator's drive.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures that the IC package is tested without being harmed, as the controlled force application and surface contact minimize damage, allowing for reliable and safe testing without destroying the package.
Implementation Method 1
a plurality of springs 600 are provided between the actuator 60 and the base 10 so as to restore the rotate elements 70 to an original statue
Implementation Method 2
What's more, when the IC package 40 is located between the lower portion 503b and the sliding plate 30, the lower portion 503b, IC package 40 and the sliding plate 30 are in a relative rest condition. There is no friction among the three components, which will never destroy IC package.
Data Source
AI summary
A burn-in socket for an IC package includes a base loaded with several terminals, a sliding plate, an actuator and a pair of locking elements. The sliding plate is assembled on the base and defines an upper surface. The actuator is mounted on the base and defines a receiving opening facing the upper surface. The locking elements is assembled on the actuator under a condition that the locking elements rotate inwards to press against the IC package and outwards to release the IC package when the actuator is push downwards in a vertical direction. Each locking element includes a rotating element and a pressing element. The rotating elements rotate in relative to the actuator and the pressing element rotates in relative to the rotating element. The pressing element defines a sliding slot and the rotating element defines a sliding post slidably receiving in the sliding slot.