Burn-in Test Thermal Plate with Pneumatic Pressure Chamber
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Solution Overview
Problem
Current burn-in test devices for semiconductors and LEDs face challenges in thermal management due to high electrical power consumption, leading to ineffective temperature regulation and cooling during testing.
Innovation Solution
The apparatus employs a thermal conductive plate with a cooling channel and a pressure chamber mechanism that uses compressed air to hold the device under test against the plate, combined with a pin guide system for electrical current transmission, enabling enhanced heating and cooling regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high electrical power is consumed to drive large arrays of semiconductors and LEDs, then the device under test can be operated at full capacity, but thermal management becomes increasingly difficult and temperature regulation becomes ineffective
Solution Approach 1:
The thermal management system is segmented into multiple independent cooling channels embedded in the thermal conductive plate, allowing localized cooling for different regions of the device array. This segmentation enables effective heat removal from high-power areas while maintaining stable temperature across the entire array, resolving the contradiction between high power operation and temperature regulation.
Solution Approach 2:
A thermal conductive plate with embedded cooling channels serves as an intermediary between the high-power devices and the cooling system. The plate distributes heat uniformly across its surface while the cooling channels efficiently remove it, enabling high power consumption without excessive temperature rise.
2Device complexity
If conventional thermal management systems are used, then the structure is relatively simple, but temperature control precision and cooling effectiveness are insufficient
Solution Approach 1:
The thermal conductive plate merges multiple functions into a single component: it provides mechanical support for the device array, distributes heat uniformly across the surface, and integrates cooling channels for active heat removal. This merging achieves precise temperature control without proportionally increasing structural complexity.
Solution Approach 2:
The system uses a liquid cooling medium flowing through embedded channels to remove heat. The hydraulic cooling system provides efficient heat transfer with precise temperature control, achieving effective cooling without complex mechanical structures.
3Reliability
If the device under test is held mechanically, then the contact is reliable, but the structure becomes complex and the device is more vulnerable to damage
Solution Approach 1:
The mechanical holding system is replaced with a pneumatic pressure chamber that uses compressed air to press the device array against the thermal conductive plate. This substitution maintains reliable contact while simplifying the structure and reducing mechanical stress on the devices, avoiding vulnerability to damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides effective thermal management, allowing for precise temperature control and uniform heat distribution across large arrays of semiconductors and LEDs during burn-in testing, overcoming the limitations of previous technologies.
Implementation Method 1
a thermal conductive plate including a cooling channel for allowing passage of a cooling medium for regulating temperature of the thermal conductive plate
Implementation Method 2
an air inlet for receiving compressed air to exert uniform pressure on a surface of the device under test to press said device under test against the thermal conductive plate
Implementation Method 3
a pin guide means including an upper guide embedded in the thermal conductive plate for holding a pogo pin, and a lower guide positioned below the thermal conductive plate for coupling the pogo pin and contacting said pogo pin with the device under test; and wherein said pogo pin is connected with an electrical current supply for supplying electrical current to the device under test
Data Source
AI summary
The present invention relates to an apparatus for burn-in of a device under test (4), characterized by: a thermal conductive plate (2) including a cooling channel (3) for allowing passage of a cooling medium for regulating temperature of the thermal conductive plate (2); the device under test (4) placed on the thermal conductive plate (2); a pressure chamber (5) engaged to the device under test (4), comprising a hollow housing (6) including an integrated cooling passage (7), an air inlet (8), a seal (9) and air outlet (10) aid in regulating temperature of said pressure chamber; and a pin guide means comprising an upper guide (11) embedded in the thermal conductive plate (2) and a lower guide (12) for guiding movement of the pogo pin (13) and its connection with the device under test (4).