Burner Cover Insulation Structure for Thermal Shock and Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional burner stones and sealing gaskets in condensing boilers face high failure rates due to fragility, thermo shock, and chemical solubility issues, leading to reduced protection and sealing efficiency in harsh environments.
Innovation Solution
A burner cover insulation device comprising a heat-resistant inorganic fibrous cover layer, a support layer for mechanical strength, and an insulating filling material, connected through holes for thermal protection and mechanical integrity, with optional sealing elements on the support layer for enhanced sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If vermiculite burner stone is used for thermal insulation, then insulation performance is improved, but mechanical strength and thermo shock resistance deteriorate
Solution Approach 1:
The patent applies composite materials by combining vermiculite granules (providing thermal insulation) with a binding agent (providing mechanical strength). This composite structure allows the burner stone to maintain both insulation performance and structural integrity under thermal stress and mechanical loads.
2Temperature
If inorganic fibre burner stone is used for thermal insulation, then insulation performance is improved, but chemical stability deteriorates due to solubility in condensate
Solution Approach 1:
The patent changes the chemical parameters of the binding agent to ensure it is resistant to condensate corrosion. By selecting a binding agent with appropriate chemical properties (resistance to acidic condensate), the composite burner stone maintains both insulation performance and chemical stability in the condensing boiler environment.
3Strength
If binder is added to burner stone for mechanical strength, then structural integrity is improved, but reliability deteriorates due to binder burnout at high temperatures
Solution Approach 1:
The patent accepts that the binding agent is temporary and will be consumed during operation. The binder provides mechanical strength during installation and handling, then gradually burns out or decomposes at high temperatures, allowing the vermiculite structure to become the primary load-bearing component that is resistant to thermal degradation.
4Reliability
If sealing gasket is used to prevent gas escape, then sealing performance is improved, but reliability deteriorates due to high temperature degradation
Solution Approach 1:
The patent uses composite materials for the sealing gasket, combining materials that provide both sealing capability and high temperature resistance. This may include heat-resistant rubber compounds or composite structures that maintain elastic sealing properties even in the high-temperature environment of the boiler.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device provides improved mechanical strength, thermo shock resistance, and durability, reducing maintenance costs and preventing debris contamination, while maintaining thermal insulation and sealing efficiency even in extreme boiler conditions.
Implementation Method 1
a burner cover insulation device for shielding a burner cover from a boiler burner
Implementation Method 2
the cover layer comprises a heat resistant inorganic fibrous material
Data Source
AI summary
The invention relates to a burner cover insulation device for shielding a burner cover from a boiler burner, the device comprising a cover layer comprising a heat resistant inorganic fibrous material and having a first outer peripheral edge; a support layer providing mechanical strength to the device and having a second outer peripheral edge that at least extends to the outer peripheral edge of the cover layer; and a filling material forming an insulating layer between the cover layer and the support layer, wherein a through hole extends through the cover layer and the support layer. The invention furthermore relates to a method for manufacturing such a device.