Bus Bar Assembly Insert Molding Alignment

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Solution Overview

Problem

Existing bus bar assemblies in electric power converters face challenges in maintaining precise positional alignment between first and second bus bars during resin molding, leading to misalignment, reduced heat dissipation, and increased production costs due to complex mold structures and excessive resin use.

Innovation Solution

A bus bar assembly design where only the first bus bar is insert-molded with a resinous body, while the second bus bar is not, allowing for simpler mold construction and improved heat dissipation by exposing its surface, and using bosses and openings to maintain positional alignment and insulation resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If both first and second bus bars are insert-molded with resin to maintain positional alignment, then positional alignment is improved, but mold complexity increases

Engineering Contradiction:
Improvepositional alignmentVSAvoidmold structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent extracts the second bus bar from the resin molding process, leaving only the first bus bar to be insert-molded. This eliminates the complexity of holding both bus bars in the mold while maintaining positional alignment through the resin's structural support and the exposed second bus bar's alternative positioning method.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If both bus bars are completely covered with resin for insulation, then insulation resistance is improved, but heat dissipation ability deteriorates

Engineering Contradiction:
Improveinsulation resistanceVSAvoidheat dissipation
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent applies different treatment to different parts of the bus bars. The first bus bar is partially covered with resin for insulation while its connecting terminals remain exposed. The second bus bar is completely exposed. This local differentiation provides sufficient insulation where needed while maximizing heat dissipation surfaces.

Inventive Principle:
Principle #3Local quality

3Manufacturing precision

If both bus bars are insert-molded with resin, then positional alignment is improved, but production cost increases

Engineering Contradiction:
Improvepositional alignmentVSAvoidproduction cost
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent removes the second bus bar from the resin molding process, reducing the complexity of the mold structure and the amount of resin material required. This simplification directly lowers production costs while the first bus bar's insert-molding and the resin's structural role maintain adequate positional alignment.

Inventive Principle:
Principle #2Taking out (Extraction)

4Ease of operation

If connecting terminals of both bus bars are exposed outside resin case, then ease of connection is improved, but mold complexity increases

Engineering Contradiction:
Improveconnection accessibilityVSAvoidmold structure
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent extracts the second bus bar entirely from the resin molding process, leaving it completely exposed with its connecting terminals accessible. The first bus bar's terminals are also exposed through the resin case design. This approach achieves connection accessibility without requiring complex multi-directional mold drawing mechanisms.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS8383939B2Structure of bus bar assembly
Publication Date: 2013.02.26 DENSO CORP
  • US8383939B2 patent drawing
  • US8383939B2 patent drawing
  • US8383939B2 patent drawing

AI summary

A bus bar assembly used for establish electric connections with semiconductor modules of an electric power converter. The bus bar assembly includes a resinous body, a first and a second bus bar to which terminals of the semiconductor modules are to be connected. Each of the first and second bus bars includes a plate body and a plurality of connecting terminals extending from the plate body substantially in parallel to a major surface of the plate body. At least a portion of the body plate of the first bus bar is disposed inside the resinous body. The second bus bar is mounted at the plate body on the resinous body and laid to overlap the first bus bar at a given distance away from the first bus bar. This structure minimizes the misalignment between the first and second bus bars after the resinous body is formed.