Bus Bar Heat Dissipation Structure for Compact Inverter Packaging
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Solution Overview
Problem
Conventional inverter devices face challenges in suppressing heat generation and reducing size due to space restrictions and inductance requirements, making it difficult to increase the cross-sectional area of DC-power-input bus bars for effective heat dissipation.
Innovation Solution
A bus bar heat dissipation structure that includes a pair of bus bars connected between a smoothing capacitor and a power semiconductor module, with a heat sink and insulating members integrated with a resin member, allowing for improved rigidity and heat dissipation while reducing the device's size by eliminating the need for a large heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the cross-sectional area of bus bars is increased to improve heat dissipation, then heat dissipation performance is improved, but the device size increases and space requirements are not met
Solution Approach 1:
The heat sink is integrated with the bus bar structure through integral molding, combining the bus bar and heat sink into a single unified component. This eliminates the need for separate heat dissipation structures while maintaining effective heat transfer from the bus bar to the heat sink, thereby improving heat dissipation without increasing overall device volume.
Solution Approach 2:
The heat sink extends in the vertical direction (thickness dimension) rather than requiring increased horizontal cross-sectional area. By utilizing the thickness dimension of the bus bar structure, the design achieves enhanced heat dissipation surface area without expanding the device's footprint or overall volume.
2Temperature
If the cross-sectional area of bus bars is increased to improve heat dissipation, then heat dissipation performance is improved, but rigidity and structural stability are compromised
Solution Approach 1:
The heat sink and bus bar are integrally molded as a single structure, ensuring rigid structural connection between the two components. This integral construction maintains the mechanical strength and rigidity of the bus bar while incorporating effective heat dissipation features, eliminating the need for separate attachments that could compromise structural integrity.
3Reliability
If insulation distance is increased to ensure safety, then electrical insulation is improved, but the device size increases
Solution Approach 1:
The resin molding simultaneously performs multiple functions: it provides electrical insulation between bus bars of different potentials, mechanically connects the bus bar and heat sink, and maintains proper spacing. This multi-functional integration achieves required insulation distances without requiring additional space for separate insulation components.
Solution Approach 2:
The resin material serves multiple purposes: electrical insulation, mechanical bonding, structural support, and spacing maintenance. By using a single material to fulfill multiple functions, the design achieves reliable electrical insulation while minimizing overall device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure enhances the heat dissipation and rigidity of bus bars, reduces the inverter device's size, and shields electrical and magnetic noise from the power semiconductor module, preventing malfunction of electronic components.
Implementation Method 1
a heat dissipation main body part disposed between the pair of bus bars; and a case-side fixing leg part fastened to the case, at one end side of the heat dissipation main body part
Data Source
AI summary
In an inverter device 1, a pair of bus bars P and N are disposed along each other between a smoothing capacitor 2 and a power semiconductor module 3 and are connected to the smoothing capacitor 2 and the power semiconductor module 3. A heat sink 5 is disposed between the bus bars P and N along the bus bars P and N. Insulating members 6 are disposed between the bus bar P and the heat sink 5 and between the bus bar N and the heat sink 5. A part of the heat sink 5 is connected to a case 4 on which the power semiconductor module 3 is mounted.