Dielectric-Covered Bus Bar With EMC Filter for Inverter Noise

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional bus bars used in electric vehicle systems, particularly in EMC filter circuits, often fail to adequately reduce noise emissions from inverters and electric motor drives, leading to interference with other circuit components.

Innovation Solution

A bus bar design featuring a metal sheet with a dielectric covering, integrated with an EMC filter element, allows for reduced noise transmission by enabling flexible shaping and improved electrical properties, including short ground paths and dense circuit element mounting, while providing a cost-effective alternative to traditional printed circuit boards.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If conventional PCBs with metallized conducting structures are used for power transmission, then circuit elements can be mounted on the board, but the power transfer capability is limited and noise reduction is insufficient

Engineering Contradiction:
Improvepower transfer capabilityVSAvoidnoise emissions
Core Design Contradiction:
PowerVSObject-generated harmful factors

Solution Approach 1:

The patent inverts the conventional PCB construction by placing a metal sheet with dielectric covering instead of a dielectric core with metallized structures. This inversion enables superior power transfer capability and noise reduction while maintaining circuit element mounting functionality.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The bus bar combines metal sheet and dielectric material in a composite structure where the metal provides excellent electrical conductivity and power transfer, while the dielectric covering provides insulation and noise reduction, achieving both power and EMC requirements simultaneously.

Inventive Principle:
Principle #40Composite materials

2Power

If PCBs with thicker metallizations are used to increase power transfer, then power capability improves, but manufacturing complexity and cost increase

Engineering Contradiction:
Improvepower transfer capabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
PowerVSEase of manufacture

Solution Approach 1:

Instead of increasing metallization thickness on a PCB, the patent inverts the structure to use a metal sheet as the base with dielectric covering, achieving high power capability through the inherent properties of the metal sheet rather than thick metallization layers.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent changes the fundamental structural parameters from thin metallized layers on dielectric to a metal sheet with dielectric covering, transforming the power transfer mechanism while simplifying manufacturing compared to thick PCB metallization.

Inventive Principle:
Principle #35Parameter changes

3Power

If a metal sheet with dielectric covering is used instead of conventional PCB, then power transfer and noise reduction improve, but the construction is counterintuitive and may increase manufacturing complexity

Engineering Contradiction:
Improvepower transfer capabilityVSAvoidconstruction complexity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The patent employs structural inversion, using metal sheet with dielectric covering instead of the conventional dielectric core with metallized structures. This counterintuitive approach simplifies the power transfer function while improving EMC performance.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The metal sheet with dielectric covering serves multiple functions simultaneously: power transmission, circuit element mounting substrate, and EMC shielding, reducing overall device complexity despite the unconventional construction.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Object-generated harmful factors

If conventional PCBs are used for EMC filtering, then circuit elements can be mounted, but noise emissions are not adequately reduced

Engineering Contradiction:
Improvenoise emissionsVSAvoidpower transfer capability
Core Design Contradiction:
Object-generated harmful factorsVSPower

Solution Approach 1:

The bus bar uses a composite structure of metal sheet and dielectric material where the metal provides superior EMC shielding and noise reduction while maintaining excellent power transfer capability, outperforming conventional PCB-based EMC filters.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

By inverting the conventional PCB construction to use metal sheet with dielectric covering, the patent achieves both superior noise reduction and power transfer capability simultaneously, resolving the trade-off present in conventional EMC filter designs.

Inventive Principle:
Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The bus bar effectively reduces noise emissions and enhances electrical performance by allowing for compact, high-density integration of circuit elements and efficient noise reduction, suitable for high-power applications in electric vehicle systems.

Implementation Method 1

The first rail comprises a central section with a metal sheet and a dielectric material at least partially covering the central section

Methodology Applied
Scientific EffectDielectric: Dielectric

Data Source

PatentUS11910523B2Bus bar
Publication Date: 2024.02.20 TDK ELECTRONICS AG
  • US11910523B2 patent drawing
  • US11910523B2 patent drawing
  • US11910523B2 patent drawing

AI summary

In an embodiment a bus bar includes a first interface and a second interface, a filter element electrically connected between the first and the second interface and a first rail between the first interface and the second interface, wherein the first rail includes a central section with a metal sheet and a dielectric material at least partially covering the central section.