Bus Bar Interconnection Using Insulative Grommet for Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High electric current levels and concomitant heat dissipation requirements in power electronics devices pose challenges in device packaging and assembly, particularly in miniaturization efforts where space is limited.
Innovation Solution
A technique involving a printed wiring board, electrical bus bars, and a heat dissipating device, such as a cold plate, with a unique connection mechanism using an electrically insulative grommet and fastener to maintain thermal and electrical isolation, facilitating efficient heat transfer and compact assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If bus bars are directly connected to the heat dissipation device, then thermal transfer efficiency is improved, but electrical insulation reliability deteriorates
Solution Approach 1:
The patent introduces an electrically insulative grommet as an intermediary component positioned between the bus bar and the heat dissipation device. This grommet maintains thermal contact while providing electrical insulation, thus resolving the contradiction between improving heat dissipation efficiency and maintaining electrical insulation reliability.
2Ease of manufacture
If conventional connection methods are used, then assembly simplicity is maintained, but thermal contact effectiveness deteriorates
Solution Approach 1:
The patent merges the thermal conduction function and electrical insulation function into a single integrated grommet component. This allows the assembly process to remain simple while achieving effective thermal contact, as the grommet simultaneously provides both thermal pathways and electrical isolation.
3Reliability
If more insulation components are added, then electrical insulation reliability is improved, but device complexity increases
Solution Approach 1:
The grommet is designed as a multi-functional component that simultaneously provides electrical insulation, thermal conduction, and mechanical positioning. This universal design achieves reliable electrical insulation without increasing assembly complexity, as a single component performs multiple functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat dissipation and compact power electronics assembly, addressing the challenges of high current levels and miniaturization while ensuring reliable electrical and thermal connections.
Implementation Method 1
heat dissipating device, such as a cold plate
Implementation Method 2
electrically insulative grommet
Data Source
AI summary
One system of the present application includes an electronic assembly with a heat dissipating device, printed wiring board with electronic circuitry, bus bar, insulative grommet, and fastener. The board defines a bus with an interconnection pad and a board opening. The bus bar connects with the interconnection pad and defines a bar opening with a beveled shoulder portion that align with the board opening to define a passage to a fastening site of the heat dissipating device. The grommet defines a distal end portion opposite a proximal end portion shaped with a flange. The distal end portion is inserted into the passage with the flange abutting the beveled shoulder portion. The fastener extends through the grommet to provide a mechanical connection of the board and bar to the site and maintain thermal coupling between the board and device while the grommet electrically insulates the fastener from the bar.