Thermally Conductive Insulating Element for Bus Bar Heat Dissipation

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Solution Overview

Problem

Existing electrical equipment faces challenges in efficiently transferring heat away from components while maintaining electrical isolation to prevent user shock, as conductive materials like copper are expensive and pose safety risks when in direct contact with enclosures.

Innovation Solution

A thermally conductive and electrically isolating element is used as a heat sink to absorb heat from current paths and transfer it to the enclosure, reducing the need for copper and providing isolation between current-carrying components and the enclosure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If copper or other conductive materials are used to transfer heat away from electrical components, then heat transfer efficiency is improved, but cost increases and safety risks arise due to potential electrical shock

Engineering Contradiction:
Improvecomponent temperatureVSAvoidelectrical shock risk
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an intermediate material that is thermally conductive but electrically insulating, positioned between the electrical component and the enclosure. This intermediary allows heat to be transferred from the component to the enclosure while preventing electrical current from reaching the enclosure, thus eliminating the electrical shock risk associated with using conductive materials like copper.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs composite materials that combine thermal conductivity with electrical insulation properties. These composite materials enable simultaneous achievement of effective heat transfer and electrical isolation, resolving the contradiction between heat transfer efficiency and safety.

Inventive Principle:
Principle #40Composite materials

2Temperature

If copper is used for heat transfer, then heat dissipation is effective, but material cost increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidcopper usage
Core Design Contradiction:
TemperatureVSQuantity of substance

Solution Approach 1:

The patent replaces expensive copper materials with more economical alternative materials that provide the necessary thermal conduction functionality. These alternative materials achieve the same heat dissipation effect at lower material cost, reducing the quantity and value of expensive substances required.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the material parameters by selecting materials with appropriate thermal conductivity and electrical resistivity characteristics. This parameter optimization allows effective heat transfer without relying on expensive conductive materials like copper.

Inventive Principle:
Principle #35Parameter changes

3Temperature

If conductive materials are placed in contact with the enclosure for heat transfer, then heat transfer efficiency is improved, but electrical isolation is compromised

Engineering Contradiction:
Improveheat transfer rateVSAvoidelectrical isolation
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent uses an intermediate insulating material between the electrical component and the enclosure to maintain electrical isolation while enabling thermal conduction. This intermediary layer ensures that heat can be transferred effectively without compromising the electrical safety and isolation of the system.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively lowers internal component temperatures, reduces copper usage, and ensures user safety by preventing electrical shock and short circuits, while enhancing dielectric performance and shielding against electromagnetic interference.

Implementation Method 1

The element includes a first surface contacting the interior surface and is configured to transfer heat from the bus bar to the enclosure

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

A thermally conductive and electrically isolating element is used as a heat sink to absorb heat from current paths and transfer it to the enclosure

Methodology Applied
Scientific EffectHeat sink: Heat Sink

Data Source

PatentUS8270167B2Heat transfer apparatus for use with electrical devices
Publication Date: 2012.09.18 ABB (SCHWEIZ) AG
  • US8270167B2 patent drawing
  • US8270167B2 patent drawing
  • US8270167B2 patent drawing

AI summary

An electrical device includes an enclosure having an interior surface, at least one bus bar, and an element enclosing at least a portion of the bus bar, wherein the element includes a first surface contacting the interior surface and is configured to transfer heat from the bus bar to the enclosure and configured to provide electrical isolation between the enclosure and the bus bar.