Bus Bar Press-Fit PCB Assembly for Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing circuit board assemblies face challenges in securely and efficiently connecting bus bars and electrical leads without damaging the printed circuit board, while maintaining effective electrical coupling and heat dissipation.

Innovation Solution

A circuit board assembly is designed with a press-fit mechanism that secures a bus bar into an opening defined by the printed circuit board, creating a slot for an electrical lead, which is then soldered to the bus bar using wave soldering, eliminating the need for adhesives and ensuring secure mechanical and electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If solder is used to create electrical connections between bus bars and electrical components, then electrical coupling is achieved, but the process becomes complex and time-consuming

Engineering Contradiction:

Improveelectrical couplingVSAvoidassembly process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the mechanical press-fit connection and electrical solder connection into a single integrated process. The bus bar is press-fit into the PCB opening first, establishing mechanical support and alignment, then solder is applied to create electrical coupling between the bus bar, electrical lead, and PCB trace, achieving both mechanical and electrical connection in one assembly sequence

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The bus bar is press-fit into the PCB opening before soldering is performed. This preliminary mechanical installation provides precise positioning and support for the bus bar, ensuring proper alignment with the electrical lead and PCB trace before the soldering process begins, which simplifies the overall assembly process

Inventive Principle:

Principle #10Preliminary action

2Strength

If bus bars are securely connected to the printed circuit board, then mechanical stability is improved, but the printed circuit board may be damaged

Engineering Contradiction:

Improvemechanical connectionVSAvoidPCB damage

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The connection structure is segmented into three distinct components: the PCB opening, the bus bar, and the electrical lead. The bus bar is press-fit into the PCB opening to provide mechanical support and positioning, while the electrical lead is positioned in the slot between the bus bar side and opening side, separating the mechanical support function from the electrical connection function and distributing mechanical stresses

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The bus bar acts as an intermediary element between the PCB and the electrical lead. It is press-fit into the PCB opening to provide mechanical support and alignment, while the electrical lead is positioned in the slot created between the bus bar and opening, allowing the bus bar to mediate mechanical forces and protect the PCB from direct stress from the electrical lead

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances electrical efficiency by minimizing interconnection losses and allows for effective heat dissipation from electrical components to the bus bar, while maintaining the integrity of the printed circuit board.

Implementation Method 1

The bus bar is secured in the opening of the printed circuit board via a press-fit

Methodology Applied

Scientific EffectPress-fit: Mechanical Force

Implementation Method 2

solder disposed between the electrical lead and the bus bar to electrically couple the electrical lead and the bus bar

Methodology Applied

Scientific EffectSoldering: Soldering

Implementation Method 3

allows for effective heat dissipation from electrical components to the bus bar

Methodology Applied

Scientific EffectHeat dissipation: Conduction (thermal)

Data Source

PatentUS20190200452A1Circuit board assemblies and methods of assembling circuit boards and bus bars

Publication Date: 2019.06.27 AES GLOBAL HLDG PTE LTD

AI summary

According to some aspects of the present disclosure, circuit board assemblies are disclosed. Example circuit board assemblies include a printed circuit board having a first surface and a second surface, and defining an opening having at least one side extending from the first surface to the second surface. The assembly also includes a bus bar having a first surface, a second surface, and at least one side. The bus bar is secured in the opening of the printed circuit board via a press-fit, such that a slot is defined between the at least one side of the bus bar and the at least one side of the opening defined by the printed circuit board. The assembly further includes an electrical lead positioned in the slot, and solder disposed between the electrical lead and the bus bar to electrically couple the electrical lead and the bus bar.