Semiconductor Module Bus Bar Press-Contact Connection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor module manufacturing involves complex reflow soldering processes for connecting bus bars to wiring substrates, requiring jigs and increasing manufacturing complexity.
Innovation Solution
A semiconductor module design where bus bars are inserted into a frame body with a projection, featuring a first region embedded in the side wall, a second region extending outward, and a third region bent to press-contact the wiring pattern, eliminating the need for soldering and jigs by using press-contact connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If reflow soldering is used to connect bus bar to wiring substrate, then electrical connection is achieved, but manufacturing complexity increases due to required jigs and complex process
Solution Approach 1:
The patent replaces the soldering process (thermal/chemical connection) with a mechanical press-contact connection. The bus bar is pressed directly against the wiring substrate contact pad through a mounting structure, eliminating the need for soldering jigs and reflow soldering processes while maintaining reliable electrical connection.
Solution Approach 2:
The mounting structure automatically maintains the bus bar in the correct position and applies necessary contact pressure through its own structural design (clamping mechanism), eliminating the need for external jigs to hold the bus bar vertically and maintain position during connection.
2Reliability
If reflow soldering process is used, then electrical connection is established, but manufacturing time and cost increase
Solution Approach 1:
The mechanical press-contact connection eliminates the time-consuming reflow soldering process, allowing for faster assembly without compromising connection reliability. The simple pressing action can be performed rapidly compared to the multi-step soldering process.
3Reliability
If bus bar is connected with solder, then electrical connection is achieved, but manufacturing simplicity is reduced due to jig requirements
Solution Approach 1:
The mounting structure is self-contained and self-positioning, with the bus bar fitting into a designated space and being automatically clamped in the correct position. This eliminates the need for complex positioning jigs and simplifies the manufacturing process.
Solution Approach 2:
The simple mechanical pressing and clamping mechanism replaces the complex soldering fixture system, making the manufacturing process more straightforward and easier to implement.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A semiconductor module according to one embodiment includes a semiconductor chip, a wiring substrate, a mounting plate provided with the wiring substrate thereon, a frame body defining a case for the wiring substrate, together with the mounting plate, a bus bar extending from the case and being inserted into a side wall of the frame. The side wall has a projection. The bus bar includes a first region in the side wall, a second region extending from a first end of the first region outward from the frame, a third region extending from a second end of the first region into the frame. The third region is bent based on the shape being close to the wiring substrate of the projection. The mounting plate with the wiring substrate is attached to the frame such that the third region is in press-contact with the wiring pattern.