Restricting Member Prevents Adhesive Escape in Bus Bar Junction

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Solution Overview

Problem

Conventional heat dissipation techniques using cold setting adhesives in electronic components face reduced heat transfer efficiency due to thermal cycles, as the adhesives soften and escape from between bus bars and heat dissipation members, leading to insufficient heat transfer and reduced dissipation effects.

Innovation Solution

A circuit structure incorporating a restricting member, such as a frame plate or insulating sheet, that prevents the movement and escape of insulating heat-transfer materials like cold setting adhesives between bus bars and heat dissipation members, maintaining effective heat transfer even under temperature changes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If cold setting adhesive is used as insulating heat-transfer material, then heat curing steps are omitted, but the adhesive escapes from between bus bar and heat dissipation member due to thermal cycles

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidheat transfer stability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The restricting member is installed beforehand between the bus bar and heat dissipation member to prevent the cold setting adhesive from escaping during thermal cycles, ensuring reliable heat transfer while maintaining manufacturing simplicity

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The restricting member acts as an intermediary component between the bus bar and heat dissipation member, physically blocking the adhesive from moving outward while allowing heat to transfer through the adhesive layer

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If cold setting adhesive is used, then production time is reduced, but heat dissipation effect decreases due to adhesive escape

Engineering Contradiction:

Improveproduction efficiencyVSAvoidheat dissipation efficiency

Core Design Contradiction:

ProductivityVSLoss of energy

Solution Approach 1:

The restricting member is pre-installed to prevent adhesive escape during service, maintaining heat dissipation efficiency while preserving the production efficiency gains from using cold setting adhesive

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The restricting member converts the potential harm of adhesive escape into a controlled situation where the adhesive remains in place to effectively transfer heat, while the cold setting adhesive itself provides the benefit of rapid production

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Reliability

If restricting member is added, then heat transfer stability is improved, but device complexity increases

Engineering Contradiction:

Improveheat transfer stabilityVSAvoidstructural complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The restricting member is placed only at the specific location where adhesive escape occurs (between bus bar and heat dissipation member), providing targeted protection without adding complexity to the entire device structure

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The restricting member is positioned asymmetrically only where needed to prevent adhesive escape, rather than adding symmetric structural elements throughout the entire assembly, minimizing overall complexity

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses reductions in heat dissipation efficiency caused by thermal cycles, ensuring stable heat transfer from electronic components to heat dissipation members, while omitting the need for heat curing steps.

Implementation Method 1

a heat dissipation member provided on a side of the plurality of bus bars that is opposite to the side on which the electronic component is connected, via an insulating heat-transfer material that has insulating properties and heat transferring properties

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

a restricting member that is provided between the plurality of bus bars and the heat dissipation member, and that restricts movement of the insulating heat-transfer material caused by an increase in the temperature of the insulating heat-transfer material

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10820406B2Circuit structure and electrical junction box

Publication Date: 2020.10.27 AUTONETWORKS TECH LTD

AI summary

A circuit structure includes a circuit board having a connection opening. An electronic component is mounted on a top surface side of the circuit board, and a plurality of bus bars are disposed on a bottom surface side thereof, the electronic component includes a plurality of connection terminals, and a connection terminal of the plurality of connection terminals is connected to a bus bar on the bottom surface side of the circuit board via the connection opening. The circuit structure includes a heat dissipation member provided on a side of the plurality of bus bars opposite to a surface on which the electronic component is connected, an insulating heat-transfer material having insulating properties and heat transferring properties, and a restricting member is provided between the plurality of bus bars and the heat dissipation member, and restricts movement of the insulating heat-transfer material caused by an increase in temperature.