Bus Bar Socket Arrangement for PCB Power Delivery
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Solution Overview
Problem
The existing methods for providing power to semiconductor packages on printed circuit boards often require additional power and ground layers, which are costly and impractical, leading to inefficiencies in power distribution and increased costs.
Innovation Solution
A socket arrangement with first and second bus bars that extend from a header adjacent to the printed circuit board, electrically coupling to power and ground contacts of the semiconductor package, providing a pathway for power with reduced voltage drop and allowing for increased power delivery without adding extra layers to the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If additional power and ground layers are introduced to the printed circuit board to provide increased power to semiconductor packages, then the power delivery capacity is improved, but the manufacturing cost and device complexity increase
Solution Approach 1:
The patent transitions from a two-dimensional PCB layer-based power distribution to a three-dimensional solution using bus bars that extend vertically from the PCB surface. The bus bars provide additional power delivery capacity by utilizing the vertical dimension, allowing multiple power paths without increasing the number of PCB layers.
Solution Approach 2:
The bus bars serve as an intermediary component between the PCB power supply connections and the semiconductor package power contacts. These intermediate conductive elements facilitate increased power delivery by providing low-impedance pathways that supplement the existing PCB trace infrastructure.
2Power
If additional power and ground layers are introduced to the printed circuit board, then the power delivery capacity is improved, but the manufacturing cost increases
Solution Approach 1:
The patent extracts the power delivery enhancement function from the PCB layer structure and implements it through separate bus bar components. This extraction allows the power delivery capacity to be improved without modifying the fundamental PCB layer construction, thereby avoiding the increased manufacturing costs associated with multi-layer PCB fabrication.
3Power
If additional power and ground layers are introduced to the printed circuit board, then the power delivery capacity is improved, but the practical implementability decreases
Solution Approach 1:
The patent segments the power delivery function into distinct components: the existing PCB power traces and the added bus bar elements. This segmentation allows the power delivery enhancement to be implemented independently of the PCB layer structure, improving practical implementability by enabling modular addition of power capacity without reconfiguring the entire PCB architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient power provision to semiconductor packages with reduced voltage drop and increased power capacity, resulting in cost and power savings by eliminating the need for additional board layers.
Implementation Method 1
the first bus bar is to extend from the header adjacent to the printed circuit board (PCB), and is to electrically couple to a power supply contact of a component package and to a power supply connection within a proximity of a power source
Data Source
AI summary
Apparatuses and systems associated with power provision for packages mounted to a printed circuit board are disclosed herein. In embodiments, a socket arrangement may include a header and a first bus bar, wherein the first bus bar is to extend from the header adjacent to the PCB, and is to electrically couple to a power supply contact of a component package and to a power supply connection within a proximity of a power source, wherein a power output of the power source is electrically coupled to the power supply connection. The socket arrangement may further include a second bus bar, wherein the second bus bar is to extend from the header adjacent to the PCB, and is to electrically couple to a ground contact of the component package and a ground connection within the proximity of the power source. Other embodiments may be described and/or claimed.