Bus Bar Surface Embossing During Resin Cover Molding
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Solution Overview
Problem
The manufacturing process of bus bars with unevenness structures on contact surfaces and partially embedded in resin is complicated due to multiple steps, including forming the unevenness structure and molding with a cover material.
Innovation Solution
A method where a pressing member with an unevenness surface is used to simultaneously mold a cover portion over the bus bar, transferring the unevenness structure to the outer surface during pressure contact, thereby simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the unevenness structure is formed by laser irradiation or press processing before molding, then the contact surface quality is improved, but the manufacturing process becomes complicated due to multiple steps
Solution Approach 1:
The patent combines the unevenness structure formation and the molding process into a single integrated step. The pressing member with unevenness directly forms the unevenness structure on the bus bar contact surface while simultaneously molding the cover material, eliminating the need for separate laser irradiation or press processing steps before molding.
Solution Approach 2:
The pressing member is pre-designed with the desired unevenness pattern on its pressing surface. This preliminary preparation of the pressing member allows the unevenness structure to be transferred to the bus bar during the molding process itself, rather than requiring separate preliminary processing of the bus bar.
2Manufacturing precision
If multiple steps are used to form unevenness structure and mold with cover material, then the structural quality is improved, but the productivity is reduced due to increased manufacturing time
Solution Approach 1:
The patent merges the unevenness structure formation and cover material molding into a single simultaneous operation. The pressing member forms the unevenness structure on the bus bar while the cover material is molded around it in the same process cycle, thereby improving productivity without compromising structural quality.
Solution Approach 2:
The molding process continuously performs dual functions: forming the cover material structure and creating the unevenness pattern on the bus bar contact surface. This continuous simultaneous action eliminates idle time between separate operations, thereby enhancing manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of manufacturing steps and facilitates easy production of electronic components with unevenness structures by integrating molding and embossing steps.
Implementation Method 1
the pressing member covers another part of the outer surface such that the pressing surface comes into pressure contact with the another part, the unevenness is transferred to the another part when the pressing surface comes into pressure contact with the another part
Data Source
AI summary
An electronic component includes a main body that includes an electronic element, a bus bar that is electrically connected to the electronic element, and a cover portion that covers a part of an outer surface of the bus bar. A method for manufacturing an electronic component includes molding the cover portion. In molding the cover portion, a pressing member including a pressing surface with unevenness is used. In molding the cover portion, the pressing member covers another part of the outer surface such that the pressing surface comes into pressure contact with the another part, the cover material is placed around the pressing member to mold the cover portion, and the unevenness is transferred to the another part when the pressing surface comes into pressure contact with the another part, thereby forming an unevenness structure.