Heated Windscreen Busbar Adhesive Placement
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Solution Overview
Problem
Existing busbars used in heated windscreens lack a secure and consistent method for installation, often resulting in air gaps and irregularities due to the absence of a tin coating, which can lead to oxidation and structural instability.
Innovation Solution
A busbar with a dimensionally invariant conductive substrate and a strategically applied adhesive material, where the adhesive is secured through heat and pressure, ensuring precise placement and preventing oxidation, while maintaining electrical conductivity and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive material is applied across the entirety of the major surface of the copper strip, then adhesion area is maximized, but adhesive may ball or become inhomogeneously distributed leading to air gaps and irregularities during installation
Solution Approach 1:
The adhesive material is applied only to a central portion of the major surface of the conductive substrate, specifically within a width that is 0.6 to 1.2 times the width of the conductive substrate, rather than covering the entire surface. This localized application prevents adhesive from reaching the edges where it would ball or become inhomogeneous, while still providing sufficient adhesion area for secure bonding during installation.
2Reliability
If the busbar is made thin to avoid air gaps between glass panes, then the risk of heating element failure is reduced, but the busbar becomes more susceptible to oxidation and environmental degradation
Solution Approach 1:
The busbar is constructed as a composite structure with a conductive substrate (copper or copper alloy) that provides electrical conductivity, and a protective coating layer applied to the major surfaces that prevents oxidation and environmental degradation. This composite approach maintains the thin profile needed to avoid air gaps while incorporating protective functionality to resist harmful environmental factors.
3Strength
If adhesive material is applied to the entire major surface, then maximum bonding area is achieved, but installation complexity increases due to need for precise positioning and potential adhesive overflow
Solution Approach 1:
The adhesive material is confined to a central portion of the major surface rather than the entire surface. This localized application simplifies installation by eliminating the need for precise edge-to-edge positioning and prevents adhesive overflow beyond the busbar edges. The central placement provides a generous tolerance zone for installers while maintaining sufficient bonding area for secure attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a secure, consistent, and efficient method for busbar installation, preventing oxidation and ensuring reliable electrical connectivity without air gaps, enhancing the busbar's durability and performance in heated windscreen applications.
Implementation Method 1
The adhesive material may be secured to the conductive material through the application of heat and/or pressure.
Implementation Method 2
The adhesive material may be secured to the conductive material through the application of heat and/or pressure.
Implementation Method 3
In the absence of a tin coating, and in order to prevent oxidation of the copper strip, the polymeric coating and adhesive layer has to be applied across the entirety of each major surface of said copper strip.
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3B
AI summary
A busbar (1) for installation on or in a structure, the busbar (1) comprises a length of electrically conductive material (2) having a, preferably dimensionally invariant, adhesive material (3) secured along at least part of a major surface along the length thereof, wherein the adhesive material (3) is inboard of one both of the longitudinal edges of the electrically conductive material (2).