Side-by-Side Busbar Assembly for Compact Insulation Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional busbar assemblies are difficult to downsize in the vertical direction while ensuring reliable electrical insulation, as the thin insulating resin between laminated busbars can lead to leakage current issues.
Innovation Solution
The busbar assembly features conductive metal flat plates with opposing side surfaces facing each other, with an insulating resin layer filling the gap between them, providing both electrical insulation and mechanical connection, allowing for downsizing in the vertical direction and reducing leakage current risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the insulating resin between the first flat busbar and the second flat busbar is made thin in order to downsize in a vertical direction, then the vertical size is reduced, but leakage current may occur between the busbars
Solution Approach 1:
The patent transitions from a vertical lamination structure to a side-by-side arrangement where busbars are disposed in the same plane with gaps between opposing side surfaces. This dimensional change allows the insulating resin to fill lateral gaps rather than spanning the entire vertical thickness, enabling downsizing while maintaining insulation reliability through adequate resin thickness.
2Length of moving object
If conventional laminated busbar assemblies are used, then mechanical connection is achieved, but downsizing in vertical direction is difficult
Solution Approach 1:
The invention repositions busbars from vertical stacking to horizontal arrangement in the same plane, with insulating resin filling gaps between opposing side surfaces. This dimensional reconfiguration reduces vertical height while maintaining mechanical connection through the resin's bonding function, achieving both downsizing and manufacturing feasibility.
3Reliability
If the entirety of upper surface of the first flat plate busbar and the entirety of lower surface of the second flat plate busbar are disposed to face each other with insulating resin therebetween, then mechanical connection is ensured, but sufficient insulation reliability is difficult to ensure
Solution Approach 1:
The patent changes the facing arrangement from entire upper and lower surfaces in vertical stacking to specific regions of opposing side surfaces in horizontal arrangement. This dimensional shift reduces the total facing surface area between busbars, allowing adequate insulating resin thickness for reliable insulation while simplifying the overall structure compared to full-surface lamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient downsizing of busbar assemblies while ensuring reliable electrical insulation and mechanical connection, preventing leakage current between busbars, and allowing for precise manufacturing of busbar assemblies with improved insulation reliability.
Implementation Method 1
an insulating resin layer 30 filling the gap 40 between the opposing side surfaces 13, 13 of the first and second busbars 10a, 10b
Implementation Method 2
the insulating resin layer 30 filling the gap 40 between the opposing side surfaces 13, 13 of the first and second busbars 10a, 10b and mechanically connecting the opposing side surfaces 13, 13
Data Source
Figure 1A~1C
Figure 2
Figure 3A~3B
AI summary
A busbar assembly (1a-1d) according to the present invention includes a first busbar (10a) formed by a conductive metal flat plate; a second busbar (10b) formed by a conductive metal flat plate, the second busbar (10b) disposed in the same plane as the first busbar (10a) with a gap (40) being provided between opposing side surfaces (13) of the first and second busbars (10a, 10b); and an insulating resin layer (30) filled in the gap (40) so as to mechanically connect the opposing side surfaces (13) of the first and second busbars (10a, 10b). Preferably, the opposing side surface (13) of at least one of the first and second busbars (10a, 10b) is an inclined surface that is closer to the opposing side surface (13) of the other of the first and second busbars (10a, 10b) from one side toward the other side in the thickness direction.