Busbar Circuit Board Assembly for High-Current Power Transmission
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Solution Overview
Problem
Conventional printed circuit boards handling high electrical power require thicker traces, increasing manufacturing costs due to the larger amount of trace material needed, which is inefficient and costly.
Innovation Solution
An electrical connection assembly featuring a substrate with a busbar and trace, where the busbar is thicker than the trace, allowing higher current transmission while reducing the trace thickness and material costs, using a substrate with apertures and conductive materials like copper-based busbars and traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If thicker traces are used to handle high electrical power, then the power handling capability is improved, but the manufacturing cost increases due to larger amount of trace material
Solution Approach 1:
The patent divides the power transmission function into two separate components: traces for low-current signal transmission and a busbar for high-current power transmission. This segmentation allows each component to be optimized for its specific function, with the busbar handling the high power loads while the traces maintain their standard thickness, thereby reducing overall material usage and manufacturing cost while maintaining power handling capability.
2Power
If thicker traces are used to handle high electrical power, then the power handling capability is improved, but the amount of trace material increases
Solution Approach 1:
The patent separates the power transmission function from the trace structure by introducing a dedicated busbar component. The traces remain thin and use minimal material for their intended low-current function, while the busbar independently handles high-current power transmission. This eliminates the need to increase trace material quantity for power handling applications.
Solution Approach 2:
The busbar serves as a multi-functional component that provides both mechanical support and high-current power transmission capability. By consolidating the power handling function into this single component, the patent eliminates the need for thick traces, thereby reducing the quantity of trace material required while maintaining the ability to handle high electrical power.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient high-current transmission with reduced trace thickness, lowering manufacturing costs and material usage compared to conventional printed circuit boards.
Implementation Method 1
A pin is disposed in both the substrate aperture and the busbar aperture, wherein the pin is in electrical communication with the busbar and the trace
Data Source
AI summary
An electrical connection assembly includes a substrate having first and second sides and a substrate aperture formed therein. The substrate is made of an electrically non-conductive material. A busbar is attached to the first side of the substrate. The busbar has a busbar aperture formed therein. A trace is formed on the second surface of the substrate. The busbar and trace are formed of an electrically conductive material. A pin is disposed in both the substrate aperture and the busbar aperture, wherein the pin is in electrical communication with the busbar and the trace.