Busbar Circuit Assembly with Exposed Thermal Contact
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Solution Overview
Problem
Conventional circuit assemblies face challenges with heat dissipation and cooling performance, particularly due to the inefficiency of heat transfer through thin copper foil and obstruction by insulating resin between the busbar and radiator.
Innovation Solution
A circuit assembly with a holding member made of resin, integrally formed with busbars having exposed regions for direct contact with a heat-dissipation sheet, allowing improved heat transfer without the insulating resin in between, enhancing the heat dissipation performance of electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating film is formed on a metal plate to create a circuit pattern, then electrical insulation is achieved, but heat dissipation performance deteriorates due to the thin copper foil being inefficient at transferring heat
Solution Approach 1:
The patent removes the insulating film from between the metal plate and the heat-dissipating component. By extracting this insulating layer, the metal plate directly contacts the component, enabling efficient heat transfer through the high thermal conductivity of the metal while maintaining electrical insulation through alternative means (the resin holding member provides insulation elsewhere in the structure).
Solution Approach 2:
The patent employs a composite structure where a resin holding member (providing electrical insulation) is integrated with a metal plate (providing thermal conduction). This composite design allows different materials to perform their specialized functions: the resin ensures electrical isolation while the metal plate handles heat dissipation, resolving the contradiction between insulation and heat transfer.
2Reliability
If insulating resin is provided between the busbar and radiator to hold the busbar, then mechanical support and electrical insulation are achieved, but heat transfer from the electronic component is obstructed
Solution Approach 1:
The patent extracts the insulating resin from the heat transfer path between the busbar and the radiator. By removing this insulating material from the thermal conduction route, direct thermal contact is established between the metal busbar and radiator, enabling efficient heat transfer while the resin holding member provides insulation at other critical locations.
Solution Approach 2:
The patent applies insulation selectively rather than universally. The resin holding member provides electrical insulation where needed (supporting the busbar and providing overall structural insulation) while deliberately leaving the heat transfer interface between the busbar and radiator free of insulating material. This localized application of insulation properties allows simultaneous achievement of electrical safety and thermal efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation efficiency from electronic components, even in smaller sizes, by providing a larger contact area and reducing thermal resistance, thus effectively addressing the limitations of conventional designs.
Implementation Method 1
the bottom surface of the circuit assembly comes into contact with a heat-dissipation sheet... significantly improves heat dissipation efficiency from electronic components... by providing a larger contact area and reducing thermal resistance
Data Source
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AI summary
Each of busbars includes a bottom surface and a top surface. A holding member is made of resin and is formed integrally with the busbars. The bottom surface of each of the busbars includes exposed regions which are exposed downwards from the holding member.