Busbar Assembly Layout for Compact Insulation Between Parallel Busbars
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Solution Overview
Problem
Conventional busbar assemblies face challenges in ensuring reliable electrical insulation and efficient semiconductor element arrangement due to limitations in gap width between conductive metal flat plates, which affects the insulating property and size reduction in the vertical direction.
Innovation Solution
A busbar assembly with conductive flat plate busbars arranged in a common plane and connected by an insulating resin layer, featuring gap filling and surface laminated parts that expose predetermined areas for semiconductor element mounting, allowing for reduced gap width while maintaining effective insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the gap width between busbars is reduced to downsize the busbar assembly, then the vertical dimension is reduced, but the electrical insulating property deteriorates and leakage current risk increases
Solution Approach 1:
The insulating resin layer is designed with different thicknesses in different regions: a first thickness in the gap filling region and a second thickness (greater than the first) in the laminated region. This local variation in insulating thickness provides enhanced insulation where needed while maintaining compact overall dimensions, resolving the contradiction between downsizing and insulating reliability.
Solution Approach 2:
The insulating resin layer is formed by laminating multiple insulating resin films together. This composite structure provides superior electrical insulation properties compared to a single layer, enabling reliable insulation even when the overall gap width is reduced, thus resolving the contradiction between compact size and insulating reliability.
2Area of stationary object
If the gap width between busbars is reduced to enable compact semiconductor element arrangement, then the aggregate arrangement capability is improved, but the insulating property between busbars deteriorates
Solution Approach 1:
The insulating resin layer has a first thickness in the gap filling part and a second thickness (greater than the first) in the laminated part. This local differentiation allows the gap between busbars to be minimized for compact semiconductor arrangement while the laminated region provides enhanced insulation, resolving the contradiction between area utilization and insulating reliability.
Solution Approach 2:
Instead of increasing gap width in the horizontal dimension to improve insulation, the solution adds thickness in the vertical dimension through laminated insulating resin films. This dimensional transition allows compact horizontal arrangement of semiconductors while maintaining superior insulation through increased vertical thickness of the insulating layer.
3Volume of moving object
If the insulating resin layer is made thin to downsize the busbar assembly, then the vertical dimension is reduced, but the electrical insulation reliability deteriorates
Solution Approach 1:
The insulating resin layer is designed with a first thickness in the gap filling part and a second thickness (greater than the first) in the laminated part. This local variation allows the overall assembly to be compact while providing enhanced insulation thickness in critical regions, resolving the contradiction between compact size and insulation reliability.
Solution Approach 2:
Multiple insulating resin films are laminated together to form the insulating resin layer, creating a composite structure with superior electrical insulation properties. This composite approach enables the use of thinner overall insulation while maintaining high reliability through the combined properties of multiple layers.
Data Source
AI summary
A busbar assembly of the present invention includes first and second busbars disposed in parallel in a common plane with a gap therebetween, and an insulating resin layer including a gap filling part and an upper surface laminated part, the upper surface laminated part having a first busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the first busbar and the gap filling part that straddles a boundary therebetween, and a second busbar-side upper surface opening that exposes a predetermined area of the upper surfaces of the second busbar and the gap filling part that straddles a boundary therebetween, a part of the upper surface laminated part between the first and second busbar-side upper surface openings forming a partitioning wall.