Busbar Cooling Connection With Insulated Heat Sink Interface
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Solution Overview
Problem
Conventional busbar cooling methods face challenges such as electrical shorts, galvanic corrosion, and increased costs due to the use of additional components like screws, washers, and nuts, which are not effectively addressed by existing technologies.
Innovation Solution
A busbar configuration with a connection extending parallel to the current flow, where a thermal interface material contacts a heat sink when secured, is proposed. This configuration is manufactured using an extrusion process and applies the thermal interface material to the interior surface of the connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling methods use contacting metal heat sinks to remove heat from busbars, then cooling effectiveness is improved, but electrical shorts and galvanic corrosion risks increase
Solution Approach 1:
The patent introduces an electrically insulating thermal interface material as an intermediary between the metal heat sink and the busbar. This mediator enables efficient thermal conduction while blocking electrical current flow, thereby preventing electrical shorts and galvanic corrosion while maintaining effective heat removal from the busbar.
Solution Approach 2:
The patent employs composite material structures combining metal heat sinks with electrically insulating thermal interface materials. This composite approach leverages the high thermal conductivity of metals while incorporating the electrical insulation properties of the interface material, achieving both effective cooling and electrical safety.
2Strength
If screws, washers, and nuts are used to secure heat sinks to busbars, then mechanical attachment is achieved, but device complexity and cost increase
Solution Approach 1:
The patent merges the functions of mechanical attachment and thermal interface into a single integrated component. The electrically insulating thermal interface material serves both as the thermal coupling medium and as part of the mechanical attachment system, eliminating the need for separate screws, washers, and nuts while maintaining secure heat sink attachment.
Solution Approach 2:
The thermal interface material performs multiple functions simultaneously: it provides thermal conduction, electrical insulation, and contributes to mechanical attachment. This multi-functional design replaces multiple specialized components (screws for attachment, washers for insulation, nuts for fastening) with a single universal element.
3Loss of energy
If exceptionally large and thick busbars are used to minimize resistive heating, then heat generation is reduced, but device complexity and space requirements increase
Solution Approach 1:
The patent introduces a heat sink with thermal interface material as an intermediary heat removal system. This mediator provides an additional parallel heat path for thermal energy removal, allowing the use of thinner, less complex busbars while maintaining acceptable temperature levels through active heat extraction.
Solution Approach 2:
The patent segments the heat management function into two separate components: the busbar for current conduction and the heat sink for dedicated heat removal. This segmentation allows the busbar to be optimized for electrical performance with reduced dimensions, while the heat sink handles the thermal management burden separately.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively enhances busbar cooling without the need for overly thick busbars or additional components, thereby reducing the risk of electrical shorts and galvanic corrosion while maintaining cost-effectiveness.
Implementation Method 1
a thermal interface material of the connection contacts a heat sink when the heat sink is secured to the connection
Implementation Method 2
monolithically forming the busbar and a connection using an extrusion process
Data Source
AI summary
A busbar configured to transport current between two locations in an electrical system is provided herein and comprises a connection extending from the busbar parallel to a direction of current flow and configured so that a thermal interface material of the connection contacts a heat sink when the heat sink is secured to the connection.