Busbar Cooling Channel Structure for Compact Power Module Assembly

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Solution Overview

Problem

Existing semiconductor assemblies face challenges in efficiently cooling power semiconductor modules with high integration density while maintaining reliability and minimizing space and production costs.

Innovation Solution

Incorporating a closed cooling channel structure produced partially by Friction Stir Channeling (FSC) method in the connection elements, such as busbars, to enhance thermal conductivity and dissipate heat effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If planar mounting and connection technology is used to achieve miniaturization, then space requirements are reduced, but cooling efficiency deteriorates

Engineering Contradiction:

Improvespace requirementVSAvoidcooling efficiency

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent merges the electrical connection function (busbar) with the thermal management function (cooling channel structure) into a single integrated component. The busbar contains internal cooling channels that directly contact the semiconductor element, combining power transmission and heat dissipation in one element, thereby achieving both miniaturization and effective cooling.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from external cooling methods to internal cooling by embedding cooling channels within the busbar structure. This dimensional integration allows heat dissipation to occur through the volume of the connection element itself rather than requiring separate external cooling components, enabling compact design without sacrificing cooling performance.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If additional cooling components are added to improve heat dissipation, then cooling efficiency is improved, but device complexity increases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidcomponent quantity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The busbar is designed to perform dual functions: electrical connection and thermal management. By integrating cooling channels within the busbar, the patent eliminates the need for separate cooling components, thereby improving cooling efficiency while reducing device complexity and component count.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The busbar is transformed from a single-function electrical connector into a multi-functional component that simultaneously provides electrical connection, mechanical support, and thermal management. This universal design reduces the total number of components needed in the semiconductor assembly.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Manufacturing precision

If FSC method is used to produce cooling channels, then manufacturing precision and cooling efficiency are improved, but production complexity increases

Engineering Contradiction:

Improvecooling channel precisionVSAvoidproduction process complexity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The cooling channels are formed within the busbar during the manufacturing process itself, before final assembly. The FSC method creates precise internal channels as part of the busbar fabrication, eliminating the need for post-manufacturing modifications or separate cooling component assembly, thereby reducing overall production complexity despite the advanced manufacturing technique used.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The FSC method allows for precise, economical, and efficient heat dissipation through thermally conductive channels, improving cooling efficiency and reducing the need for additional components, thus enhancing reliability and reducing space requirements.

Implementation Method 1

the busbar has a closed cooling channel structure with at least one cooling channel which is produced at least partially by means of an FSC method

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

cooling channel structure with at least one cooling channel which is produced at least partially by means of an FSC method

Methodology Applied

Scientific EffectFriction stir channeling:

Data Source

PatentUS12538801B2Semiconductor assembly comprising a first semiconductor element and a first connection element

Publication Date: 2026.01.27 SIEMENS AG

AI summary

A semiconductor assembly includes a semiconductor element designed as a power semiconductor module and comprising a contact, and a connection element designed as a busbar which is connected to the contact of the power semiconductor module via a force-fit connection, in particular a screw connection. The busbar includes a cover plate and a closed cooling channel structure with a cooling channel which is produced at least partially by an FSC (Friction Stir Channeling) method and arranged to run through the cover plate.