Busbar Cooling Channel Structure for Miniaturized Power Modules
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Solution Overview
Problem
The increasing miniaturization of power electronics in power converters poses challenges for heat dissipation while maintaining high reliability and low manufacturing costs, particularly with planar assembly and interconnection technologies.
Innovation Solution
Implementing a closed cooling channel structure in connecting elements, such as busbars, using a Friction Stir Channeling (FSC) process to enhance heat dissipation, which includes a cooling channel structure with a heat transfer fluid, allowing for thermal conduction, radiation, and convection, and potentially forming a pulsating heat pipe.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If miniaturization of power electronics is implemented using planar assembly and interconnection technology, then the footprint and device size are reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The invention transitions from planar 2D heat dissipation to 3D vertical heat dissipation by implementing cooling channels within the busbar structure. The cooling channels extend through the thickness of the busbar, enabling heat to be conducted vertically from the semiconductor contacts to the busbar surfaces and dissipated through convection and radiation, thereby solving the heat dissipation limitation imposed by miniaturization.
Solution Approach 2:
The busbar serves as a thermal intermediary between the semiconductor elements and the environment. By embedding cooling channels within the busbar, the busbar acts as a heat transfer medium that conducts heat from the semiconductor contacts through its interior and dissipates it to the surrounding air, effectively mediating the thermal management in the miniaturized device.
2Temperature
If conventional cooling solutions are added to miniaturized devices, then heat dissipation is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The invention merges the electrical connection function and thermal management function into a single integrated busbar component. The busbar simultaneously serves as an electrical conductor connecting semiconductor elements and as a cooling structure with embedded channels, eliminating the need for separate cooling components and reducing overall device complexity.
Solution Approach 2:
The busbar is designed to perform multiple functions: electrical connection, mechanical support, and thermal management. By incorporating cooling channels within the busbar structure, the same component that provides electrical interconnection also provides passive cooling, achieving multi-functionality without increasing device complexity.
3Ease of manufacture
If passive cooling structures are implemented in connecting elements, then manufacturing cost is reduced, but heat dissipation efficiency may be compromised
Solution Approach 1:
The cooling system is designed to be self-service and self-contained within the busbar structure. The cooling channels are integrated into the busbar during manufacturing, requiring no external pumps, fans, or active control systems. The passive cooling structure relies on natural convection and conduction, making the system self-sufficient while maintaining manufacturing simplicity and cost-effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient heat dissipation and reduced thermal resistance, improving reliability and reducing manufacturing costs by utilizing a flexible and cost-effective cooling channel structure that is adapted to the component geometry.
Implementation Method 1
allowing for thermal conduction, radiation, and convection
Implementation Method 2
allowing for thermal conduction, radiation, and convection
Implementation Method 3
allowing for thermal conduction, radiation, and convection
Implementation Method 4
potentially forming a pulsating heat pipe
Implementation Method 5
potentially forming a pulsating heat pipe
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The invention relates to a semiconductor assembly (2) comprising a semiconductor element (4) and at least one connection element (22, 24, 26), wherein the semiconductor element (4) has at least one contact (10, 12, 14), wherein at least one connection element (22, 24, 26) is connected to a contact (10, 12, 14) of the semiconductor element (4). According to the invention, in order to economically and easily improve the cooling of the semiconductor assembly (2), the connection element (22, 24, 26) has a cooling channel structure (30) with at least one cooling channel (32) which is produced at least partially by means of an FSC method.