Busbar Cooling Layout for Semiconductor Heat Dissipation
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Solution Overview
Problem
Existing power control apparatuses face inefficiencies in heat dissipation, particularly with busbars, which are both electrical and thermal conductors, leading to inadequate management of heat generated by semiconductor elements.
Innovation Solution
The power control apparatus incorporates a busbar unit with a first plate-shaped portion facing the cooling device's internal passage for efficient heat absorption and a second plate-shaped portion with a narrower side surface facing the semiconductor module to suppress heat reception, enhancing heat dissipation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the busbar is positioned to face the semiconductor module with a larger surface area, then the heat reception from the semiconductor element is increased, but the heat dissipation performance of the busbar is reduced
Solution Approach 1:
The busbar is designed with two plate-shaped portions having different orientations and surface areas. The first plate-shaped portion has a larger surface area facing the cooling device for efficient heat dissipation, while the second plate-shaped portion has a narrower side surface facing the semiconductor module to minimize heat reception. This local differentiation of surface properties resolves the contradiction between heat reception and heat dissipation performance.
Solution Approach 2:
The busbar structure transitions from a single-plane configuration to a multi-dimensional arrangement with two plate-shaped portions oriented at different angles. The first portion extends in one direction to maximize cooling surface area, while the second portion extends perpendicular to it to minimize exposure to heat sources. This dimensional change allows simultaneous optimization of both heat reception and heat dissipation.
2Loss of energy
If the busbar is configured for optimal heat dissipation, then the heat dissipation performance is improved, but the heat reception from the semiconductor element is reduced
Solution Approach 1:
The busbar employs local quality differentiation by assigning different surface characteristics to different portions. The first plate-shaped portion is optimized for heat dissipation with a larger surface area facing the cooling device, while the second plate-shaped portion is optimized for minimal heat reception with a narrower side surface facing the semiconductor module. This resolves the contradiction by allowing each portion to perform its specific function optimally.
3Device complexity
If the busbar uses a conventional single-plate configuration, then the structural simplicity is maintained, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The busbar is segmented into two distinct plate-shaped portions with different orientations and surface areas. The first plate-shaped portion is dedicated to heat dissipation with a larger surface facing the cooling device, while the second plate-shaped portion handles electrical connection with a narrower side surface. This segmentation improves heat dissipation efficiency without significantly increasing overall structural complexity.
Solution Approach 2:
The busbar structure evolves from a conventional single-plane configuration to a multi-dimensional arrangement where the two plate-shaped portions are oriented at different angles relative to each other and to the cooling device. This dimensional transformation enables enhanced heat dissipation efficiency while maintaining relatively simple structural implementation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the amount of heat received by the busbar from the semiconductor element while improving heat dissipation, thereby ensuring efficient thermal management and reducing vibration stress.
Implementation Method 1
The busbars are not only electric conductor but also thermal conductor
Implementation Method 2
a cooling device which cools the semiconductor module by enabling a cooling fluid to flow through an internal passage
Implementation Method 3
the wider width surface of the first plate shaped portion can be cooled by the cooling device, so that the busbar can efficiently absorb heat
Implementation Method 4
the heat from the semiconductor module is received by the side surface with the narrower width of the second plate shaped portion, so that the amount of heat received by the busbar can be suppressed
Data Source
AI summary
A power control apparatus includes a busbar unit which supports a plurality of busbars connected to a plurality of semiconductor modules. The busbar includes a first plate shaped portion and a second plate shaped portion. The first plate shaped portion is adjacent to a cooling device in a posture facing an internal passage of the cooling device in the plate thickness direction. The second plate shaped portion is placed in a posture in which a plate thickness direction thereof intersects with a plate thickness direction of the first plate shaped portion. The second plate shaped portion has outer surfaces including a side surface having a narrower width corresponding to a plate thickness. The second plate shaped portion is placed in a posture in which the side surface faces the semiconductor module.