Busbar Detour Layout for Relay Heat Dissipation in Tight Circuits

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Solution Overview

Problem

Conventional circuit structures face challenges in heat dissipation due to limited space for heat dissipation busbars, as they are positioned directly under heat-generating components, restricting the size and placement of heat dissipation components.

Innovation Solution

A circuit structure design that includes a heat-generating component, a busbar with a detour portion connecting electrical and heat transfer portions, a base member with through holes, an insulating plate, and a metal heat dissipation member, allowing for efficient heat transfer and dissipation even when space is limited, using heat transfer sheets to maintain electrical insulation and prevent thermal gaps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the heat dissipation busbar size is increased to improve heat dissipation, then heat dissipation performance is improved, but the available space for disposing the heat dissipation busbar is insufficient due to circuit components located directly under the relay

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidavailable space for heat dissipation busbar
Core Design Contradiction:
TemperatureVSArea of stationary object

Solution Approach 1:

The patent transitions from a direct vertical heat transfer path to a multi-dimensional path by introducing a detour portion that extends laterally along the base member. The heat transfer connection portion is positioned at a location different from directly under the relay, utilizing the lateral dimension to bypass the space constraint caused by circuits located directly under the relay.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The busbar is segmented into distinct functional portions: an electrical connection portion that connects to the relay terminal, a detour portion that laterally connects to bypass occupied space, and a heat transfer connection portion that transfers heat to the heat dissipation busbar. This segmentation allows each portion to optimize its specific function while working together to resolve the space constraint.

Inventive Principle:
Principle #1Segmentation

2Temperature

If the heat transfer connection portion is positioned away from the heat generating component to improve heat dissipation, then heat dissipation is improved, but the electrical connection reliability may be affected

Engineering Contradiction:
Improveheat dissipationVSAvoidelectrical connection reliability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The busbar is divided into separate functional sections: the electrical connection portion maintains direct electrical connection to the relay terminal for reliability, while the heat transfer connection portion is positioned optimally for heat dissipation. The detour portion connects these sections, allowing electrical continuity while enabling spatial separation of functions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The busbar serves multiple functions simultaneously: it provides electrical connection between the relay and circuit, acts as a heat transfer path from the relay to the heat dissipation busbar, and maintains structural integrity. This multi-functionality allows a single component to resolve both electrical connection reliability and heat dissipation requirements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat dissipation efficiency, maintains electrical insulation, and allows for improved circuit design flexibility, effectively addressing the space constraints and thermal conductivity limitations in conventional designs.

Implementation Method 1

Heat generated by the relay when receiving electrical power is transferred from the terminals to the busbars

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an insulating plate that is made of an insulating material and is arranged below the heat transfer connection portion

Methodology Applied
Scientific EffectElectrical insulation: Electrical Resistance

Implementation Method 3

a heat dissipation member that is made of a metal and is arranged below the insulating plate

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 4

Heat generated by the relay when receiving electrical power is transferred from the terminals to the busbars

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS11778724B2Circuit structure
Publication Date: 2023.10.03 AUTONETWORKS TECH LTD
  • US11778724B2 patent drawing
  • US11778724B2 patent drawing
  • US11778724B2 patent drawing

AI summary

A first busbar includes a first electrical connection portion that is electrically connected to a main relay, a first heat transfer connection portion that is thermally connected to the insulating plate, and a first detour portion that connects the first electrical connection portion and the first heat transfer connection portion to each other. A second busbar includes a second electrical connection portion that is electrically connected to the main relay, a second heat transfer connection portion that is thermally connected to the insulating plate, and a lateral detour portion and a lower detour portion that connect the second electrical connection portion and the second heat transfer connection portion to each other.