Integrated Busbar Heat Conduction for Semiconductor Switches
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Solution Overview
Problem
High current switching and heat dissipation in control units, particularly in automotive electrical systems, pose challenges due to the need for massive mechanical components and inefficient heat transfer through poorly conductive printed circuit boards, with existing solutions being complex and costly.
Innovation Solution
A busbar with integrated heat-conducting elements in thermal and electrical contact with semiconductor switches, allowing heat dissipation via a heat sink while ensuring reliable insulation, and a manufacturing method that simplifies production by using a flat, rectangular sheet metal strip with pegs for secure mounting and soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat-conducting elements and heat sinks are added to dissipate heat from semiconductor switches, then heat dissipation capability is improved, but device complexity and production costs increase
Solution Approach 1:
The patent combines the busbar (power supply component) and heat-conducting element (cooling component) into a single integrated component. The busbar has heat-conducting elements pressed into it, creating a unified structure that simultaneously performs electrical power distribution and thermal management functions, eliminating the need for separate heat-conducting elements and reducing assembly steps
Solution Approach 2:
The busbar is designed to perform multiple functions: it serves as both the electrical power supply connection and the thermal conduction path to the heat sink. This multi-functional design reduces the total number of components needed in the system while maintaining effective heat dissipation
2Reliability
If electrical insulation is added between heat sink and heat-conducting element, then electrical insulation reliability is improved, but heat conduction efficiency deteriorates
Solution Approach 1:
The patent uses a thin insulating film between the heat sink and busbar that provides sufficient electrical insulation while maintaining effective thermal conduction. The film is thin enough to allow heat to pass through efficiently while being thick enough to provide the necessary electrical isolation between the heated semiconductor switch and the heat sink
3Ease of manufacture
If surface-mountable semiconductor switches are used, then ease of assembly is improved, but heat dissipation capability deteriorates due to poor thermal conduction through the printed circuit board
Solution Approach 1:
The patent extracts the heat dissipation path from the printed circuit board by using a busbar with integrated heat-conducting elements that extend through the PCB. This allows heat to be conducted directly from the semiconductor switch through the busbar to the heat sink, bypassing the poor thermal conduction of the PCB material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a cost-effective and reliable power supply and heat dissipation for semiconductor switches, enhancing operational reliability and reducing production complexity by integrating heat management directly into the busbar assembly.
Implementation Method 1
a heat-conducting element which is in thermal contact with the power semiconductor component through an opening in the printed circuit board
Implementation Method 2
a busbar lying flat on the underside of the printed circuit board and being in thermal and electrical contact with the heat-conducting element
Implementation Method 3
the heat sink arranged on the underside of the printed circuit board for dissipating the heat generated during operation of the power semiconductor component
Implementation Method 4
the heat-conducting element being in electrical contact with the power semiconductor component through the opening in the printed circuit board to supply or remove current
Data Source
Figure 1
Figure 2A~2D
Figure 3A~3C
AI summary
The present invention enables a simple and cost-effective power supply and heat dissipation for surface-mount semiconductor switches. For this purpose, a busbar is used which is in both electrical and thermal contact with the semiconductor switch via a thermal interface element. The heat generated during operation of the semiconductor switch is dissipated via a heat sink arranged on the busbar. The busbar is a simple, flat component that lies flush against the underside of the printed circuit board and forms a subassembly with it, which can be processed on a standard SMD assembly line.