Power Converter Busbar Layout With Interphase Vias for Cooling
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Solution Overview
Problem
Existing power conversion devices for automobiles face challenges in heat dissipation due to increased electric resistance caused by the stacking of positive and negative electrode wirings, which also leads to reduced sectional area and inefficient cooling.
Innovation Solution
A power conversion device design that includes a circuit board with stacked positive and negative electrode wirings in the thickness direction, along with interphase wiring parts that include vias passing through the board, allowing for improved heat dissipation while maintaining low inductance and supporting large currents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If positive electrode wiring and negative electrode wiring are stacked in all regions to connect each power module to corresponding capacitors, then inductance is reduced, but electric resistance increases due to increased number of divided parts and reduced sectional area
Solution Approach 1:
The circuit board is divided into two distinct wiring regions: a first wiring region where positive and negative electrode wirings are stacked to reduce inductance, and a second wiring region where heat dissipating vias are provided to reduce electric resistance and improve heat dissipation. This spatial segmentation allows both contradictory requirements to be satisfied in different areas.
Solution Approach 2:
Different wiring configurations are applied to different regions of the circuit board. The first wiring region has stacked positive and negative electrode wirings optimized for low inductance, while the second wiring region has heat dissipating vias optimized for low resistance and heat dissipation. Each region has localized quality tailored to its specific function.
2Temperature
If heat dissipating via is provided, then cooling performance can be improved, but electric resistance increases due to increased number of divided parts
Solution Approach 1:
The circuit board is divided into two distinct wiring regions: a first wiring region where positive and negative electrode wirings are stacked to reduce inductance, and a second wiring region where heat dissipating vias are provided to reduce electric resistance and improve heat dissipation. This spatial segmentation allows both contradictory requirements to be satisfied in different areas.
Solution Approach 2:
Different wiring configurations are applied to different regions of the circuit board. The first wiring region has stacked positive and negative electrode wirings optimized for low inductance, while the second wiring region has heat dissipating vias optimized for low resistance and heat dissipation. Each region has localized quality tailored to its specific function.
3Stability of the object's composition
If wiring sectional area is reduced to achieve low inductance, then inductance decreases, but heat dissipation becomes less effective
Solution Approach 1:
The circuit board is divided into two distinct wiring regions: a first wiring region where positive and negative electrode wirings are stacked to reduce inductance, and a second wiring region where heat dissipating vias are provided to reduce electric resistance and improve heat dissipation. This spatial segmentation allows both contradictory requirements to be satisfied in different areas.
Solution Approach 2:
Different wiring configurations are applied to different regions of the circuit board. The first wiring region has stacked positive and negative electrode wirings optimized for low inductance, while the second wiring region has heat dissipating vias optimized for low resistance and heat dissipation. Each region has localized quality tailored to its specific function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively enhances heat dissipation in power conversion devices, enabling them to handle large currents while maintaining low inductance, thus addressing the limitations of existing technologies.
Implementation Method 1
The interphase wiring part includes the plurality of positive electrode wirings and the plurality of negative electrode wirings that are separately stacked on a plane of the circuit board, and a via passing through the circuit board in a thickness direction
Data Source
AI summary
This power conversion device comprises a plurality of circuit bodies, a wiring board, and a smoothing capacitor, wherein: the wiring board has a plurality of stacked wiring parts to which the plurality of circuit bodies and the plurality of smoothing capacitors are respectively connected; and inter-phase wiring parts respectively formed between the plurality of stacked wiring parts; in the stacked wiring parts, positive electrode wires and negative electrode wires are stacked to overlap each other; in the inter-phase wiring parts, a plurality of the positive electrode wires and a plurality of the negative electrode wires are stacked to be separated from each other on a plane of the wiring board; and the inter-phase wiring parts have a via passing therethrough in the thickness direction of the wiring board.